Headphone earcup structure

A headphone earcup including a frame defining a cavity dimensioned to surround an ear of a user; a damping component coupled to the frame and encircling the cavity; a wrap component that covers the damping component and defines a continuous acoustic opening around the cavity to acoustically connect...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Panecki, Lee M, Fisher, Trang, Burello, Michael, Shaffer, Ben, Gysbers, Sarah, Minerbi, Michael B, Zaverl, Matthew, Elangovan, Krithika, Lagler, Jarrett B, Whang, Eugene, Sandieson, Christopher A, Andersen, Esge, Tikander, Miikka O, Green, Tyler A, Baran, Casey L, Siahaan, Edward, Bloom, Daniel R, Yung, Kitty
Format:	Patent
Sprache:	eng
Schlagworte:	DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS PUBLIC ADDRESS SYSTEMS
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