Headphone earcup structure

A headphone earcup including a frame defining a cavity dimensioned to surround an ear of a user; a damping component coupled to the frame and encircling the cavity; a wrap component that covers the damping component and defines a continuous acoustic opening around the cavity to acoustically connect...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Panecki, Lee M, Fisher, Trang, Burello, Michael, Shaffer, Ben, Gysbers, Sarah, Minerbi, Michael B, Zaverl, Matthew, Elangovan, Krithika, Lagler, Jarrett B, Whang, Eugene, Sandieson, Christopher A, Andersen, Esge, Tikander, Miikka O, Green, Tyler A, Baran, Casey L, Siahaan, Edward, Bloom, Daniel R, Yung, Kitty
Format:	Patent
Sprache:	eng
Schlagworte:	DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS PUBLIC ADDRESS SYSTEMS
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Beschreibung
Zusammenfassung:	A headphone earcup including a frame defining a cavity dimensioned to surround an ear of a user; a damping component coupled to the frame and encircling the cavity; a wrap component that covers the damping component and defines a continuous acoustic opening around the cavity to acoustically connect the cavity to the damping component; and a cosmetic component that covers the wrap component and the continuous acoustic opening.