Package with conductive underfill ground plane

Embodiments for a packaged semiconductor device and methods of making are provided herein, which includes a packaged semiconductor device including: a semiconductor die; a carrier; a plurality of electrical connections formed between the semiconductor die and the carrier; an electrical isolation lay...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Singh, Akhilesh Kumar, Lakhera, Nishant, Foong, Chee Seng
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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