Device for positioning a semiconductor die in a wafer prober

The invention relates to a device for positioning a semiconductor die in a wafer prober, the device comprising a carrier plate and a clamp on a front surface of the carrier plate, the dimensions of the carrier plate matching a standard geometry required by the wafer prober for receiving a semiconduc...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Trianni, Quintino Lorenzo, Torreiter, Otto Andreas, Appinger, Jörg Georg, Eckert, Martin
Format:	Patent
Sprache:	eng
Schlagworte:	MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS TESTING
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