Resistive change elements using passivating interface gaps and methods for making same

A method to fabricate a resistive change element. The method may include forming a stack over a substrate. The stack may include a conductive material, a resistive change material, a first surface, and a second surfaces opposite the first surface. The method may further include depositing a first ma...

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Bibliographische Detailangaben

Hauptverfasser:	Nozawa, Syuji, Rueckes, Thomas, Sato, Nagisa, Ramsbey, Mark, Yamaguchi, Tatsuya
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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