Substrate having electronic component embedded therein

A substrate having an electronic component embedded therein includes a core structure including a first insulating body and core wiring layers and having a cavity penetrating through a portion of the first insulating body, an electronic component disposed in the cavity, an insulating material coveri...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Byun, Dae Jung, Park, Chang Hwa, Lee, Yong Duk, Lee, Jin Won, Jeong, Sang Ho, Na, Ki Ho, Park, Je Sang
Format: Patent
Sprache:eng
Schlagworte:
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