Bond pads of semiconductor devices

A semiconductor device is provided that includes a dielectric layer, a bond pad, a passivation layer and a planar barrier. The bond pad is positioned in the dielectric layer. The passivation layer is positioned over the dielectric layer and has an opening over the bond pad. The planar barrier is pos...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Rao, Xuesong, Leong, Chee Kong, Tan, Juan Boon, Li, Xiaodong, Rajoo, Ranjan, Chockalingam, Ramasamy
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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