Bond pads of semiconductor devices

Bond pads of semiconductor devices

A semiconductor device is provided that includes a dielectric layer, a bond pad, a passivation layer and a planar barrier. The bond pad is positioned in the dielectric layer. The passivation layer is positioned over the dielectric layer and has an opening over the bond pad. The planar barrier is pos...

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Hauptverfasser: Rao, Xuesong, Leong, Chee Kong, Tan, Juan Boon, Li, Xiaodong, Rajoo, Ranjan, Chockalingam, Ramasamy
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Rao, Xuesong
Leong, Chee Kong
Tan, Juan Boon
Li, Xiaodong
Rajoo, Ranjan
Chockalingam, Ramasamy
description A semiconductor device is provided that includes a dielectric layer, a bond pad, a passivation layer and a planar barrier. The bond pad is positioned in the dielectric layer. The passivation layer is positioned over the dielectric layer and has an opening over the bond pad. The planar barrier is positioned on the bond pad.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Bond pads of semiconductor devices
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