Deep molded reflector cup used as complete LED package
An LED package creates a narrow beam in a very compact package without use of a lens. A plastic is molded around a metal lead frame (12, 14) to form a molded cup (26), where the cup has parabolic walls extending from a bottom area of the cup to a top thereof. The lead frame forms a first set of elec...
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creator | Butterworth, Mark Melvin |
description | An LED package creates a narrow beam in a very compact package without use of a lens. A plastic is molded around a metal lead frame (12, 14) to form a molded cup (26), where the cup has parabolic walls extending from a bottom area of the cup to a top thereof. The lead frame forms a first set of electrodes exposed at the bottom area of the cup for electrically contacting a set of LED die electrodes (18, 20). The lead frame also forms a second set of electrodes outside of the cup for connection to a power supply. A reflective metal (28) is then deposited on the curved walls of the cup. An LED die (16) is mounted at the bottom area of the cup and electrically connected to the first set of electrodes. The cup is then partially filled with an encapsulant (64) containing a phosphor (66). |
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The cup is then partially filled with an encapsulant (64) containing a phosphor (66).</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDBzSU0tUMjNz0lJTVEoSk3LSU0uyS9SSC4tUCgtBgolFisk5-cW5KSWpCr4uLooFCQmZyemp_IwsKYl5hSn8kJpbgZFN9cQZw_d1IL8-NRioKrUvNSS-NBgQ0MjI3NLCyMnI2Ni1AAAPs4s0Q</recordid><startdate>20220118</startdate><enddate>20220118</enddate><creator>Butterworth, Mark Melvin</creator><scope>EVB</scope></search><sort><creationdate>20220118</creationdate><title>Deep molded reflector cup used as complete LED package</title><author>Butterworth, Mark Melvin</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11227982B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Butterworth, Mark Melvin</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Butterworth, Mark Melvin</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Deep molded reflector cup used as complete LED package</title><date>2022-01-18</date><risdate>2022</risdate><abstract>An LED package creates a narrow beam in a very compact package without use of a lens. A plastic is molded around a metal lead frame (12, 14) to form a molded cup (26), where the cup has parabolic walls extending from a bottom area of the cup to a top thereof. The lead frame forms a first set of electrodes exposed at the bottom area of the cup for electrically contacting a set of LED die electrodes (18, 20). The lead frame also forms a second set of electrodes outside of the cup for connection to a power supply. A reflective metal (28) is then deposited on the curved walls of the cup. An LED die (16) is mounted at the bottom area of the cup and electrically connected to the first set of electrodes. The cup is then partially filled with an encapsulant (64) containing a phosphor (66).</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Deep molded reflector cup used as complete LED package |
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