Backlight module
A backlight module. The backlight module comprises: an LED chip (1), a transparent support (2), and a packaging adhesive (3); an accommodating groove (21) is provided on the transparent support (2), and the LED chip (1) is provided at the bottom of the accommodating groove (21); the packaging adhesi...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | Ji, Honglei Li, Zelong Qiang, Kewen Wang, Daiqing |
| description | A backlight module. The backlight module comprises: an LED chip (1), a transparent support (2), and a packaging adhesive (3); an accommodating groove (21) is provided on the transparent support (2), and the LED chip (1) is provided at the bottom of the accommodating groove (21); the packaging adhesive (3) is located in the accommodating groove (21) and covers a light-exiting surface of the LED chip (1). The LED chip (1) and the packaging adhesive (3) are provided in the accommodating groove (21), so that the transparent support (2) and the packaging adhesive (3) enlarge a light-exiting angle of the LED chip (1), thereby reducing the number of the LED chips (1) in the backlight module and reducing the production costs. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11181773B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11181773B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11181773B23</originalsourceid><addsrcrecordid>eNrjZBBwSkzOzslMzyhRyM1PKc1J5WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8aHBhoaGFobm5sZORsbEqAEApvgfVA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Backlight module</title><source>esp@cenet</source><creator>Ji, Honglei ; Li, Zelong ; Qiang, Kewen ; Wang, Daiqing</creator><creatorcontrib>Ji, Honglei ; Li, Zelong ; Qiang, Kewen ; Wang, Daiqing</creatorcontrib><description>A backlight module. The backlight module comprises: an LED chip (1), a transparent support (2), and a packaging adhesive (3); an accommodating groove (21) is provided on the transparent support (2), and the LED chip (1) is provided at the bottom of the accommodating groove (21); the packaging adhesive (3) is located in the accommodating groove (21) and covers a light-exiting surface of the LED chip (1). The LED chip (1) and the packaging adhesive (3) are provided in the accommodating groove (21), so that the transparent support (2) and the packaging adhesive (3) enlarge a light-exiting angle of the LED chip (1), thereby reducing the number of the LED chips (1) in the backlight module and reducing the production costs.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FREQUENCY-CHANGING ; NON-LINEAR OPTICS ; OPTICAL ANALOGUE/DIGITAL CONVERTERS ; OPTICAL LOGIC ELEMENTS ; OPTICS ; PHYSICS ; SEMICONDUCTOR DEVICES ; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211123&DB=EPODOC&CC=US&NR=11181773B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211123&DB=EPODOC&CC=US&NR=11181773B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Ji, Honglei</creatorcontrib><creatorcontrib>Li, Zelong</creatorcontrib><creatorcontrib>Qiang, Kewen</creatorcontrib><creatorcontrib>Wang, Daiqing</creatorcontrib><title>Backlight module</title><description>A backlight module. The backlight module comprises: an LED chip (1), a transparent support (2), and a packaging adhesive (3); an accommodating groove (21) is provided on the transparent support (2), and the LED chip (1) is provided at the bottom of the accommodating groove (21); the packaging adhesive (3) is located in the accommodating groove (21) and covers a light-exiting surface of the LED chip (1). The LED chip (1) and the packaging adhesive (3) are provided in the accommodating groove (21), so that the transparent support (2) and the packaging adhesive (3) enlarge a light-exiting angle of the LED chip (1), thereby reducing the number of the LED chips (1) in the backlight module and reducing the production costs.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FREQUENCY-CHANGING</subject><subject>NON-LINEAR OPTICS</subject><subject>OPTICAL ANALOGUE/DIGITAL CONVERTERS</subject><subject>OPTICAL LOGIC ELEMENTS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBBwSkzOzslMzyhRyM1PKc1J5WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8aHBhoaGFobm5sZORsbEqAEApvgfVA</recordid><startdate>20211123</startdate><enddate>20211123</enddate><creator>Ji, Honglei</creator><creator>Li, Zelong</creator><creator>Qiang, Kewen</creator><creator>Wang, Daiqing</creator><scope>EVB</scope></search><sort><creationdate>20211123</creationdate><title>Backlight module</title><author>Ji, Honglei ; Li, Zelong ; Qiang, Kewen ; Wang, Daiqing</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11181773B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FREQUENCY-CHANGING</topic><topic>NON-LINEAR OPTICS</topic><topic>OPTICAL ANALOGUE/DIGITAL CONVERTERS</topic><topic>OPTICAL LOGIC ELEMENTS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF</topic><toplevel>online_resources</toplevel><creatorcontrib>Ji, Honglei</creatorcontrib><creatorcontrib>Li, Zelong</creatorcontrib><creatorcontrib>Qiang, Kewen</creatorcontrib><creatorcontrib>Wang, Daiqing</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Ji, Honglei</au><au>Li, Zelong</au><au>Qiang, Kewen</au><au>Wang, Daiqing</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Backlight module</title><date>2021-11-23</date><risdate>2021</risdate><abstract>A backlight module. The backlight module comprises: an LED chip (1), a transparent support (2), and a packaging adhesive (3); an accommodating groove (21) is provided on the transparent support (2), and the LED chip (1) is provided at the bottom of the accommodating groove (21); the packaging adhesive (3) is located in the accommodating groove (21) and covers a light-exiting surface of the LED chip (1). The LED chip (1) and the packaging adhesive (3) are provided in the accommodating groove (21), so that the transparent support (2) and the packaging adhesive (3) enlarge a light-exiting angle of the LED chip (1), thereby reducing the number of the LED chips (1) in the backlight module and reducing the production costs.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US11181773B2 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS SEMICONDUCTOR DEVICES TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF |
| title | Backlight module |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-27T23%3A42%3A59IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Ji,%20Honglei&rft.date=2021-11-23&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS11181773B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |