Driving backplane, method for manufacturing the same, and display device

Driving backplane, method for manufacturing the same, and display device

The present disclosure provides a driving backplane, a method for manufacturing the same, and a display device. The driving backplane includes: a substrate; and a bonding layer located on a side of the substrate and configured to bond with a plurality of Micro LEDs arranged in an array, wherein the...

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Hauptverfasser: Fang, Yezhou, Li, Feng
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Fang, Yezhou
Li, Feng
description The present disclosure provides a driving backplane, a method for manufacturing the same, and a display device. The driving backplane includes: a substrate; and a bonding layer located on a side of the substrate and configured to bond with a plurality of Micro LEDs arranged in an array, wherein the bonding layer comprises a bonding metal layer and a conductive protection layer that are stacked sequentially along a direction away from the substrate, an orthographic projection of the conductive protection layer on the substrate substantially coinciding with an orthographic projection of the bonding metal layer on the substrate.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Driving backplane, method for manufacturing the same, and display device
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