Light emitting device including external connection electrodes, and method thereof

Light emitting device including external connection electrodes, and method thereof

The method of manufacturing a light emitting device includes: providing a first intermediate body, the first intermediate body including a temporary substrate including a base and a pair of first wirings, and a light emitting element including a pair of element electrodes, each of the pair of elemen...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Ikeda, Tadaaki, Hashimoto, Toru, Tamura, Gensui, Bando, Yoichi
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Ikeda, Tadaaki
Hashimoto, Toru
Tamura, Gensui
Bando, Yoichi
description The method of manufacturing a light emitting device includes: providing a first intermediate body, the first intermediate body including a temporary substrate including a base and a pair of first wirings, and a light emitting element including a pair of element electrodes, each of the pair of element electrodes connected to a respective one of the first wirings via a respective one of a plurality of solders; removing a portion of the temporary substrate to form a second intermediate body having a second lower surface in which a lower surface of each of the element electrodes and a lower surface of each of the plurality of solders are located; and forming a pair of external connection electrodes on the second lower surface such that each of the pair of external connection electrodes cover a respective one of the element electrodes and a respective one of the plurality of solders.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11165006B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11165006B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11165006B23</originalsourceid><addsrcrecordid>eNqNik0KwjAUBrNxIeodnnuFRrEHqCguXPmzLiH52gTSl5I8xeOr4AFczTDMVF3OofdCGIJI4J4cnsGCAtv4cN-AlyCziWQTM6yExIT4kZwcyooMOxogPjkSj4zUzdWkM7Fg8eNMLY-H2_60xphalNFYMKS9X7XW9a6q6maz_ed5A03oOIU</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Light emitting device including external connection electrodes, and method thereof</title><source>esp@cenet</source><creator>Ikeda, Tadaaki ; Hashimoto, Toru ; Tamura, Gensui ; Bando, Yoichi</creator><creatorcontrib>Ikeda, Tadaaki ; Hashimoto, Toru ; Tamura, Gensui ; Bando, Yoichi</creatorcontrib><description>The method of manufacturing a light emitting device includes: providing a first intermediate body, the first intermediate body including a temporary substrate including a base and a pair of first wirings, and a light emitting element including a pair of element electrodes, each of the pair of element electrodes connected to a respective one of the first wirings via a respective one of a plurality of solders; removing a portion of the temporary substrate to form a second intermediate body having a second lower surface in which a lower surface of each of the element electrodes and a lower surface of each of the plurality of solders are located; and forming a pair of external connection electrodes on the second lower surface such that each of the pair of external connection electrodes cover a respective one of the element electrodes and a respective one of the plurality of solders.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20211102&amp;DB=EPODOC&amp;CC=US&amp;NR=11165006B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20211102&amp;DB=EPODOC&amp;CC=US&amp;NR=11165006B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Ikeda, Tadaaki</creatorcontrib><creatorcontrib>Hashimoto, Toru</creatorcontrib><creatorcontrib>Tamura, Gensui</creatorcontrib><creatorcontrib>Bando, Yoichi</creatorcontrib><title>Light emitting device including external connection electrodes, and method thereof</title><description>The method of manufacturing a light emitting device includes: providing a first intermediate body, the first intermediate body including a temporary substrate including a base and a pair of first wirings, and a light emitting element including a pair of element electrodes, each of the pair of element electrodes connected to a respective one of the first wirings via a respective one of a plurality of solders; removing a portion of the temporary substrate to form a second intermediate body having a second lower surface in which a lower surface of each of the element electrodes and a lower surface of each of the plurality of solders are located; and forming a pair of external connection electrodes on the second lower surface such that each of the pair of external connection electrodes cover a respective one of the element electrodes and a respective one of the plurality of solders.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNik0KwjAUBrNxIeodnnuFRrEHqCguXPmzLiH52gTSl5I8xeOr4AFczTDMVF3OofdCGIJI4J4cnsGCAtv4cN-AlyCziWQTM6yExIT4kZwcyooMOxogPjkSj4zUzdWkM7Fg8eNMLY-H2_60xphalNFYMKS9X7XW9a6q6maz_ed5A03oOIU</recordid><startdate>20211102</startdate><enddate>20211102</enddate><creator>Ikeda, Tadaaki</creator><creator>Hashimoto, Toru</creator><creator>Tamura, Gensui</creator><creator>Bando, Yoichi</creator><scope>EVB</scope></search><sort><creationdate>20211102</creationdate><title>Light emitting device including external connection electrodes, and method thereof</title><author>Ikeda, Tadaaki ; Hashimoto, Toru ; Tamura, Gensui ; Bando, Yoichi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11165006B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Ikeda, Tadaaki</creatorcontrib><creatorcontrib>Hashimoto, Toru</creatorcontrib><creatorcontrib>Tamura, Gensui</creatorcontrib><creatorcontrib>Bando, Yoichi</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Ikeda, Tadaaki</au><au>Hashimoto, Toru</au><au>Tamura, Gensui</au><au>Bando, Yoichi</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Light emitting device including external connection electrodes, and method thereof</title><date>2021-11-02</date><risdate>2021</risdate><abstract>The method of manufacturing a light emitting device includes: providing a first intermediate body, the first intermediate body including a temporary substrate including a base and a pair of first wirings, and a light emitting element including a pair of element electrodes, each of the pair of element electrodes connected to a respective one of the first wirings via a respective one of a plurality of solders; removing a portion of the temporary substrate to form a second intermediate body having a second lower surface in which a lower surface of each of the element electrodes and a lower surface of each of the plurality of solders are located; and forming a pair of external connection electrodes on the second lower surface such that each of the pair of external connection electrodes cover a respective one of the element electrodes and a respective one of the plurality of solders.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US11165006B2
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Light emitting device including external connection electrodes, and method thereof
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-23T16%3A45%3A26IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Ikeda,%20Tadaaki&rft.date=2021-11-02&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS11165006B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true