Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device
An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optic...
Gespeichert in:
| Hauptverfasser: | , , , , , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | Chen, Zhenyu Ding, Liang Zhao, Bojie Huang, Zhen Jiang, Heng Tanaka, Takehiko Guo, Nan Cheng, Duanliang Wang, Mingzhu Chen, Feifan |
| description | An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11163216B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11163216B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11163216B23</originalsourceid><addsrcrecordid>eNqNjLEOwjAQQ7swIOAfjh2GtFJ3QCB2YK6uybWNlOaqS1KpX8BvUwFiZrLlZ3uZPQ8iOIHtsbW-hZ5NcgTozWydIQNDx5ED-WCjHWcSAvW1m3agrehkI9SMYn75Z4o-NahjkvcnxY5NgNiREDfQsAA50lHYWw2GRqtpnS0adIE2X11l28v5frruaeCKwoCaPMXqcVNKlUWuymNe_NN5AQUITOc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device</title><source>esp@cenet</source><creator>Chen, Zhenyu ; Ding, Liang ; Zhao, Bojie ; Huang, Zhen ; Jiang, Heng ; Tanaka, Takehiko ; Guo, Nan ; Cheng, Duanliang ; Wang, Mingzhu ; Chen, Feifan</creator><creatorcontrib>Chen, Zhenyu ; Ding, Liang ; Zhao, Bojie ; Huang, Zhen ; Jiang, Heng ; Tanaka, Takehiko ; Guo, Nan ; Cheng, Duanliang ; Wang, Mingzhu ; Chen, Feifan</creatorcontrib><description>An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.</description><language>eng</language><subject>ACCESSORIES THEREFOR ; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES ; APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM ; BASIC ELECTRIC ELEMENTS ; BLASTING ; CINEMATOGRAPHY ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; ENGINEERING ELEMENTS AND UNITS ; FRAMES, CASINGS, OR BEDS OF ENGINES OR OTHER MACHINES ORAPPARATUS NOT SPECIFIC TO AN ENGINE, MACHINE, OR APPARATUSPROVIDED FOR ELSEWHERE ; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS ; HEATING ; HOLOGRAPHY ; LIGHTING ; MECHANICAL ENGINEERING ; PHOTOGRAPHY ; PHYSICS ; PICTORIAL COMMUNICATION, e.g. TELEVISION ; SEMICONDUCTOR DEVICES ; STANDS OR SUPPORTS ; THERMAL INSULATION IN GENERAL ; WEAPONS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211102&DB=EPODOC&CC=US&NR=11163216B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211102&DB=EPODOC&CC=US&NR=11163216B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Chen, Zhenyu</creatorcontrib><creatorcontrib>Ding, Liang</creatorcontrib><creatorcontrib>Zhao, Bojie</creatorcontrib><creatorcontrib>Huang, Zhen</creatorcontrib><creatorcontrib>Jiang, Heng</creatorcontrib><creatorcontrib>Tanaka, Takehiko</creatorcontrib><creatorcontrib>Guo, Nan</creatorcontrib><creatorcontrib>Cheng, Duanliang</creatorcontrib><creatorcontrib>Wang, Mingzhu</creatorcontrib><creatorcontrib>Chen, Feifan</creatorcontrib><title>Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device</title><description>An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.</description><subject>ACCESSORIES THEREFOR</subject><subject>APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES</subject><subject>APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>ENGINEERING ELEMENTS AND UNITS</subject><subject>FRAMES, CASINGS, OR BEDS OF ENGINES OR OTHER MACHINES ORAPPARATUS NOT SPECIFIC TO AN ENGINE, MACHINE, OR APPARATUSPROVIDED FOR ELSEWHERE</subject><subject>GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS</subject><subject>HEATING</subject><subject>HOLOGRAPHY</subject><subject>LIGHTING</subject><subject>MECHANICAL ENGINEERING</subject><subject>PHOTOGRAPHY</subject><subject>PHYSICS</subject><subject>PICTORIAL COMMUNICATION, e.g. TELEVISION</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>STANDS OR SUPPORTS</subject><subject>THERMAL INSULATION IN GENERAL</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjLEOwjAQQ7swIOAfjh2GtFJ3QCB2YK6uybWNlOaqS1KpX8BvUwFiZrLlZ3uZPQ8iOIHtsbW-hZ5NcgTozWydIQNDx5ED-WCjHWcSAvW1m3agrehkI9SMYn75Z4o-NahjkvcnxY5NgNiREDfQsAA50lHYWw2GRqtpnS0adIE2X11l28v5frruaeCKwoCaPMXqcVNKlUWuymNe_NN5AQUITOc</recordid><startdate>20211102</startdate><enddate>20211102</enddate><creator>Chen, Zhenyu</creator><creator>Ding, Liang</creator><creator>Zhao, Bojie</creator><creator>Huang, Zhen</creator><creator>Jiang, Heng</creator><creator>Tanaka, Takehiko</creator><creator>Guo, Nan</creator><creator>Cheng, Duanliang</creator><creator>Wang, Mingzhu</creator><creator>Chen, Feifan</creator><scope>EVB</scope></search><sort><creationdate>20211102</creationdate><title>Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device</title><author>Chen, Zhenyu ; Ding, Liang ; Zhao, Bojie ; Huang, Zhen ; Jiang, Heng ; Tanaka, Takehiko ; Guo, Nan ; Cheng, Duanliang ; Wang, Mingzhu ; Chen, Feifan</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11163216B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>ACCESSORIES THEREFOR</topic><topic>APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES</topic><topic>APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>ENGINEERING ELEMENTS AND UNITS</topic><topic>FRAMES, CASINGS, OR BEDS OF ENGINES OR OTHER MACHINES ORAPPARATUS NOT SPECIFIC TO AN ENGINE, MACHINE, OR APPARATUSPROVIDED FOR ELSEWHERE</topic><topic>GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS</topic><topic>HEATING</topic><topic>HOLOGRAPHY</topic><topic>LIGHTING</topic><topic>MECHANICAL ENGINEERING</topic><topic>PHOTOGRAPHY</topic><topic>PHYSICS</topic><topic>PICTORIAL COMMUNICATION, e.g. TELEVISION</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>STANDS OR SUPPORTS</topic><topic>THERMAL INSULATION IN GENERAL</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>Chen, Zhenyu</creatorcontrib><creatorcontrib>Ding, Liang</creatorcontrib><creatorcontrib>Zhao, Bojie</creatorcontrib><creatorcontrib>Huang, Zhen</creatorcontrib><creatorcontrib>Jiang, Heng</creatorcontrib><creatorcontrib>Tanaka, Takehiko</creatorcontrib><creatorcontrib>Guo, Nan</creatorcontrib><creatorcontrib>Cheng, Duanliang</creatorcontrib><creatorcontrib>Wang, Mingzhu</creatorcontrib><creatorcontrib>Chen, Feifan</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Chen, Zhenyu</au><au>Ding, Liang</au><au>Zhao, Bojie</au><au>Huang, Zhen</au><au>Jiang, Heng</au><au>Tanaka, Takehiko</au><au>Guo, Nan</au><au>Cheng, Duanliang</au><au>Wang, Mingzhu</au><au>Chen, Feifan</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device</title><date>2021-11-02</date><risdate>2021</risdate><abstract>An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US11163216B2 |
| source | esp@cenet |
| subjects | ACCESSORIES THEREFOR APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM BASIC ELECTRIC ELEMENTS BLASTING CINEMATOGRAPHY ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY ENGINEERING ELEMENTS AND UNITS FRAMES, CASINGS, OR BEDS OF ENGINES OR OTHER MACHINES ORAPPARATUS NOT SPECIFIC TO AN ENGINE, MACHINE, OR APPARATUSPROVIDED FOR ELSEWHERE GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING HOLOGRAPHY LIGHTING MECHANICAL ENGINEERING PHOTOGRAPHY PHYSICS PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES STANDS OR SUPPORTS THERMAL INSULATION IN GENERAL WEAPONS |
| title | Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-25T12%3A24%3A53IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Chen,%20Zhenyu&rft.date=2021-11-02&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS11163216B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |