Upflow cooling stage for photoluminescence analysis

Systems and methods here may be configured for cooling and examining materials. In some example embodiments, the system may include a main thermoconductive body with indentations on the top surface, a bottom surface having legs structures along the edge, wherein the bottom surface and the plurality...

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Bibliographische Detailangaben
Hauptverfasser: Loudin, Lorne, Wang, Wuyi, Toosi, Mehdi
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Systems and methods here may be configured for cooling and examining materials. In some example embodiments, the system may include a main thermoconductive body with indentations on the top surface, a bottom surface having legs structures along the edge, wherein the bottom surface and the plurality of leg structures form a partially enclosed bottom chamber, and a center channel connecting the top surface and the bottom chamber.