Window molding apparatus and method of molding window using the same
A window molding apparatus includes an upper mold, a lower mold under the upper mold, and a side mold under the upper mold and adjacent to at least one side of the lower mold. The upper mold includes a first surface, the lower mold includes a second surface having a portion facing the first surface,...
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| creator | Seo, Hyunseung Cho, Jonghwan Cho, Woojin |
| description | A window molding apparatus includes an upper mold, a lower mold under the upper mold, and a side mold under the upper mold and adjacent to at least one side of the lower mold. The upper mold includes a first surface, the lower mold includes a second surface having a portion facing the first surface, and the side mold includes a third surface. The first surface includes a first flat surface and a first bent surface extending from the first flat surface, the second surface includes a second flat surface facing the first flat surface and a second bent surface extending from the second flat surface, and the third surface includes a third bent surface contacting one end of the first bent surface and facing the second bent surface. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11135752B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11135752B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11135752B23</originalsourceid><addsrcrecordid>eNrjZHAJz8xLyS9XyM3PScnMS1dILChILEosKS1WSMxLUchNLcnIT1HIT4PLl0OUlxaDOCUZqQrFibmpPAysaYk5xam8UJqbQdHNNcTZQze1ID8-tbggMTk1L7UkPjTY0NDQ2NTc1MjJyJgYNQC3bDLc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Window molding apparatus and method of molding window using the same</title><source>esp@cenet</source><creator>Seo, Hyunseung ; Cho, Jonghwan ; Cho, Woojin</creator><creatorcontrib>Seo, Hyunseung ; Cho, Jonghwan ; Cho, Woojin</creatorcontrib><description>A window molding apparatus includes an upper mold, a lower mold under the upper mold, and a side mold under the upper mold and adjacent to at least one side of the lower mold. The upper mold includes a first surface, the lower mold includes a second surface having a portion facing the first surface, and the side mold includes a third surface. The first surface includes a first flat surface and a first bent surface extending from the first flat surface, the second surface includes a second flat surface facing the first flat surface and a second bent surface extending from the second flat surface, and the third surface includes a third bent surface contacting one end of the first bent surface and facing the second bent surface.</description><language>eng</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211005&DB=EPODOC&CC=US&NR=11135752B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211005&DB=EPODOC&CC=US&NR=11135752B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Seo, Hyunseung</creatorcontrib><creatorcontrib>Cho, Jonghwan</creatorcontrib><creatorcontrib>Cho, Woojin</creatorcontrib><title>Window molding apparatus and method of molding window using the same</title><description>A window molding apparatus includes an upper mold, a lower mold under the upper mold, and a side mold under the upper mold and adjacent to at least one side of the lower mold. The upper mold includes a first surface, the lower mold includes a second surface having a portion facing the first surface, and the side mold includes a third surface. The first surface includes a first flat surface and a first bent surface extending from the first flat surface, the second surface includes a second flat surface facing the first flat surface and a second bent surface extending from the second flat surface, and the third surface includes a third bent surface contacting one end of the first bent surface and facing the second bent surface.</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAJz8xLyS9XyM3PScnMS1dILChILEosKS1WSMxLUchNLcnIT1HIT4PLl0OUlxaDOCUZqQrFibmpPAysaYk5xam8UJqbQdHNNcTZQze1ID8-tbggMTk1L7UkPjTY0NDQ2NTc1MjJyJgYNQC3bDLc</recordid><startdate>20211005</startdate><enddate>20211005</enddate><creator>Seo, Hyunseung</creator><creator>Cho, Jonghwan</creator><creator>Cho, Woojin</creator><scope>EVB</scope></search><sort><creationdate>20211005</creationdate><title>Window molding apparatus and method of molding window using the same</title><author>Seo, Hyunseung ; Cho, Jonghwan ; Cho, Woojin</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11135752B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>Seo, Hyunseung</creatorcontrib><creatorcontrib>Cho, Jonghwan</creatorcontrib><creatorcontrib>Cho, Woojin</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Seo, Hyunseung</au><au>Cho, Jonghwan</au><au>Cho, Woojin</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Window molding apparatus and method of molding window using the same</title><date>2021-10-05</date><risdate>2021</risdate><abstract>A window molding apparatus includes an upper mold, a lower mold under the upper mold, and a side mold under the upper mold and adjacent to at least one side of the lower mold. The upper mold includes a first surface, the lower mold includes a second surface having a portion facing the first surface, and the side mold includes a third surface. The first surface includes a first flat surface and a first bent surface extending from the first flat surface, the second surface includes a second flat surface facing the first flat surface and a second bent surface extending from the second flat surface, and the third surface includes a third bent surface contacting one end of the first bent surface and facing the second bent surface.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | Window molding apparatus and method of molding window using the same |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-07T17%3A01%3A39IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Seo,%20Hyunseung&rft.date=2021-10-05&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS11135752B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |