Methods of forming a semiconductor device

A method of forming a semiconductor device comprising forming a patterned resist over a stack comprising at least one material and removing a portion of the stack exposed through the patterned resist to form a stack opening. A portion of the patterned resist is laterally removed to form a trimmed re...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Wu, Jeslin J, Kothari, Rohit, Hopkins, John D, Olson, Adam L
Format: Patent
Sprache:eng
Schlagworte:
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