Thermally-conductive polymer and components

A method of forming a component includes depositing a ceramic material within an open-cell void of a polymer body. The ceramic material deposited around the periphery of the open-cell void structure forms a thermally-conductive path through the polymer body. The ceramic material circumscribes an ope...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Cordatos, Haralambos, Zafiris, Georgios S
Format: Patent
Sprache:eng
Schlagworte:
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