Multi-die device structures and methods

Examples described herein provide techniques for multi-die device structures having improved gap uniformity between neighboring dies. In some examples, a first die and a second die are attached to an interposer. A first gap is defined by and between the first die and the second die. At least one of...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Kim, Myongseob, Gandhi, Jaspreet Singh
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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