Fan-out package having a main die and a dummy die

A Fan-Out package having a main die and a dummy die side-by-side is provided. A molding material is formed along sidewalls of the main die and the dummy die, and a redistribution layer having a plurality of vias and conductive lines is positioned over the main die and the dummy die, where the plural...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Wu, Wei-Cheng, Lin, Yan-Fu, Yu, Chen-Hua, Chen, Hsien-Wei, Lee, Meng-Tsan
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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