Chip package structure including ring-like structure and method for forming the same

A method for forming a chip package structure is provided. The method includes forming a first conductive bump and a first ring-like structure over a chip. The first ring-like structure surrounds the first conductive bump, the first ring-like structure and the first conductive bump are made of a sam...

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Hauptverfasser:	Li, Chien-Chen, Liu, Kuo-Chio, Chen, Lieh-Chuan, Chu, Che-Jung, Wu, Yu-Jui, Huang, Cheng-Lin, Yang, Sheng-Yao, Li, Ling-Wei
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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creator	Li, Chien-Chen Liu, Kuo-Chio Chen, Lieh-Chuan Chu, Che-Jung Wu, Yu-Jui Huang, Cheng-Lin Yang, Sheng-Yao Li, Ling-Wei
description	A method for forming a chip package structure is provided. The method includes forming a first conductive bump and a first ring-like structure over a chip. The first ring-like structure surrounds the first conductive bump, the first ring-like structure and the first conductive bump are made of a same first material, the chip includes an interconnect structure, and the first ring-like structure is electrically insulated from the interconnect structure and the first conductive bump. The method includes bonding the chip to a substrate through the first conductive bump.
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subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
title	Chip package structure including ring-like structure and method for forming the same
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