Configuring signal devices in thermal processing systems

In some aspects, material processing head can include a body; an antenna disposed within the body; a first tag, associated with a first consumable component, disposed within a flux communication zone of the body at a first distance from the antenna, the first tag having a first resonant frequency; a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Shipulski, E. Michael, Hoffa, Michael
Format: Patent
Sprache:eng
Schlagworte:
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