ATE testing system and method for millimetre wave packaged integrated circuits

An ATE testing system (900, 1000) for millimetre wave (mmW) packaged integrated circuits (820) includes: at least one packaged integrated circuit (820); a radio frequency, RF, socket (700) configured to receive the at least one packaged integrated circuit (820) and facilitate routing RF signals ther...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Mahnke, Holger, Zanati, Abdellatif
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Mahnke, Holger
Zanati, Abdellatif
description An ATE testing system (900, 1000) for millimetre wave (mmW) packaged integrated circuits (820) includes: at least one packaged integrated circuit (820); a radio frequency, RF, socket (700) configured to receive the at least one packaged integrated circuit (820) and facilitate routing RF signals thereto via at least one input connector and at least one output connector; and at least one interface configured to couple a tester to at least one packaged integrated circuit (820). The RF socket (700) includes a mmW absorber (1010) located adjacent the at least one output connector of the RF socket (700).
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11079429B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11079429B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11079429B23</originalsourceid><addsrcrecordid>eNrjZPBzDHFVKEktLsnMS1coriwuSc1VSMxLUchNLcnIT1FIyy9SyM3MyckE8otSFcoTy1IVChKTsxPTU1MUMvNKUtOLEkuAzOTMouTSzJJiHgbWtMSc4lReKM3NoOjmGuLsoZtakB-fWgzUmpqXWhIfGmxoaGBuaWJk6WRkTIwaAAtTNsc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ATE testing system and method for millimetre wave packaged integrated circuits</title><source>esp@cenet</source><creator>Mahnke, Holger ; Zanati, Abdellatif</creator><creatorcontrib>Mahnke, Holger ; Zanati, Abdellatif</creatorcontrib><description>An ATE testing system (900, 1000) for millimetre wave (mmW) packaged integrated circuits (820) includes: at least one packaged integrated circuit (820); a radio frequency, RF, socket (700) configured to receive the at least one packaged integrated circuit (820) and facilitate routing RF signals thereto via at least one input connector and at least one output connector; and at least one interface configured to couple a tester to at least one packaged integrated circuit (820). The RF socket (700) includes a mmW absorber (1010) located adjacent the at least one output connector of the RF socket (700).</description><language>eng</language><subject>MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; TESTING</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210803&amp;DB=EPODOC&amp;CC=US&amp;NR=11079429B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210803&amp;DB=EPODOC&amp;CC=US&amp;NR=11079429B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Mahnke, Holger</creatorcontrib><creatorcontrib>Zanati, Abdellatif</creatorcontrib><title>ATE testing system and method for millimetre wave packaged integrated circuits</title><description>An ATE testing system (900, 1000) for millimetre wave (mmW) packaged integrated circuits (820) includes: at least one packaged integrated circuit (820); a radio frequency, RF, socket (700) configured to receive the at least one packaged integrated circuit (820) and facilitate routing RF signals thereto via at least one input connector and at least one output connector; and at least one interface configured to couple a tester to at least one packaged integrated circuit (820). The RF socket (700) includes a mmW absorber (1010) located adjacent the at least one output connector of the RF socket (700).</description><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPBzDHFVKEktLsnMS1coriwuSc1VSMxLUchNLcnIT1FIyy9SyM3MyckE8otSFcoTy1IVChKTsxPTU1MUMvNKUtOLEkuAzOTMouTSzJJiHgbWtMSc4lReKM3NoOjmGuLsoZtakB-fWgzUmpqXWhIfGmxoaGBuaWJk6WRkTIwaAAtTNsc</recordid><startdate>20210803</startdate><enddate>20210803</enddate><creator>Mahnke, Holger</creator><creator>Zanati, Abdellatif</creator><scope>EVB</scope></search><sort><creationdate>20210803</creationdate><title>ATE testing system and method for millimetre wave packaged integrated circuits</title><author>Mahnke, Holger ; Zanati, Abdellatif</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11079429B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>Mahnke, Holger</creatorcontrib><creatorcontrib>Zanati, Abdellatif</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Mahnke, Holger</au><au>Zanati, Abdellatif</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ATE testing system and method for millimetre wave packaged integrated circuits</title><date>2021-08-03</date><risdate>2021</risdate><abstract>An ATE testing system (900, 1000) for millimetre wave (mmW) packaged integrated circuits (820) includes: at least one packaged integrated circuit (820); a radio frequency, RF, socket (700) configured to receive the at least one packaged integrated circuit (820) and facilitate routing RF signals thereto via at least one input connector and at least one output connector; and at least one interface configured to couple a tester to at least one packaged integrated circuit (820). The RF socket (700) includes a mmW absorber (1010) located adjacent the at least one output connector of the RF socket (700).</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US11079429B2
source esp@cenet
subjects MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
title ATE testing system and method for millimetre wave packaged integrated circuits
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-29T02%3A40%3A30IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Mahnke,%20Holger&rft.date=2021-08-03&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS11079429B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true