Semiconductor chip and semiconductor package including the same

A semiconductor device includes a semiconductor substrate and a connection terminal, including a base pillar, on the semiconductor substrate. An insulation layer is formed on the semiconductor substrate, the insulation layer including an opening in the insulation layer through which the base pillar...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Lee, Ju-Ik, Shin, Seokho, Park, Sang-Oh, Kim, Dong-Wan, Han, Jung-Hoon
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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