Methods of forming electronic devices, and related electronic devices and electronic systems

An electronic device comprises a dielectric structure, interconnect structures extending into the dielectric structure and having uppermost vertical boundaries above uppermost vertical boundaries of the dielectric structure, an additional barrier material covering surfaces of the interconnect struct...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Eto, Toyonori, Wang, Kuo-Chen
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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