Haptic actuator using force multiplying spring and smart alloy wire
A haptic feedback device includes a mechanical ground and a haptic surface. A plurality of connection points is connected to the mechanical ground and a plurality of connection points is connected to the haptic surface. An electroreactive wire extends around the plurality of connection point connect...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!