Method of manufacturing via hole, method of manufacturing array substrate, and array substrate
A method of manufacturing a via hole, a method of manufacturing an array substrate and an array substrate are provided. The method of manufacturing an via hole includes: providing a base substrate; forming an insulation layer on the base substrate; etching the insulation layer by using a first etchi...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | Gong, Kui Duan, Xianxue |
description | A method of manufacturing a via hole, a method of manufacturing an array substrate and an array substrate are provided. The method of manufacturing an via hole includes: providing a base substrate; forming an insulation layer on the base substrate; etching the insulation layer by using a first etching process to forma groove in the insulation layer; performing an ion implantation process with ions on a portion of the insulation layer exposed by the groove to form an ion implantation region; and etching a portion of the insulation layer in the ion implantation region by using a second etching process to form a via hole penetrating the insulation layer. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11054707B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11054707B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11054707B23</originalsourceid><addsrcrecordid>eNrjZIjzTS3JyE9RyE9TyE3MK01LTC4pLcrMS1coy0xUyMjPSdVRyMWhIrGoKLFSobg0qbikKLEEqDAxLwVdkIeBNS0xpziVF0pzMyi6uYY4e-imFuTHpxYXJCan5qWWxIcGGxoamJqYG5g7GRkTowYAPKc8yg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method of manufacturing via hole, method of manufacturing array substrate, and array substrate</title><source>esp@cenet</source><creator>Gong, Kui ; Duan, Xianxue</creator><creatorcontrib>Gong, Kui ; Duan, Xianxue</creatorcontrib><description>A method of manufacturing a via hole, a method of manufacturing an array substrate and an array substrate are provided. The method of manufacturing an via hole includes: providing a base substrate; forming an insulation layer on the base substrate; etching the insulation layer by using a first etching process to forma groove in the insulation layer; performing an ion implantation process with ions on a portion of the insulation layer exposed by the groove to form an ion implantation region; and etching a portion of the insulation layer in the ion implantation region by using a second etching process to form a via hole penetrating the insulation layer.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FREQUENCY-CHANGING ; NON-LINEAR OPTICS ; OPTICAL ANALOGUE/DIGITAL CONVERTERS ; OPTICAL LOGIC ELEMENTS ; OPTICS ; PHYSICS ; SEMICONDUCTOR DEVICES ; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210706&DB=EPODOC&CC=US&NR=11054707B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210706&DB=EPODOC&CC=US&NR=11054707B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Gong, Kui</creatorcontrib><creatorcontrib>Duan, Xianxue</creatorcontrib><title>Method of manufacturing via hole, method of manufacturing array substrate, and array substrate</title><description>A method of manufacturing a via hole, a method of manufacturing an array substrate and an array substrate are provided. The method of manufacturing an via hole includes: providing a base substrate; forming an insulation layer on the base substrate; etching the insulation layer by using a first etching process to forma groove in the insulation layer; performing an ion implantation process with ions on a portion of the insulation layer exposed by the groove to form an ion implantation region; and etching a portion of the insulation layer in the ion implantation region by using a second etching process to form a via hole penetrating the insulation layer.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FREQUENCY-CHANGING</subject><subject>NON-LINEAR OPTICS</subject><subject>OPTICAL ANALOGUE/DIGITAL CONVERTERS</subject><subject>OPTICAL LOGIC ELEMENTS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIjzTS3JyE9RyE9TyE3MK01LTC4pLcrMS1coy0xUyMjPSdVRyMWhIrGoKLFSobg0qbikKLEEqDAxLwVdkIeBNS0xpziVF0pzMyi6uYY4e-imFuTHpxYXJCan5qWWxIcGGxoamJqYG5g7GRkTowYAPKc8yg</recordid><startdate>20210706</startdate><enddate>20210706</enddate><creator>Gong, Kui</creator><creator>Duan, Xianxue</creator><scope>EVB</scope></search><sort><creationdate>20210706</creationdate><title>Method of manufacturing via hole, method of manufacturing array substrate, and array substrate</title><author>Gong, Kui ; Duan, Xianxue</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11054707B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FREQUENCY-CHANGING</topic><topic>NON-LINEAR OPTICS</topic><topic>OPTICAL ANALOGUE/DIGITAL CONVERTERS</topic><topic>OPTICAL LOGIC ELEMENTS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF</topic><toplevel>online_resources</toplevel><creatorcontrib>Gong, Kui</creatorcontrib><creatorcontrib>Duan, Xianxue</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Gong, Kui</au><au>Duan, Xianxue</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method of manufacturing via hole, method of manufacturing array substrate, and array substrate</title><date>2021-07-06</date><risdate>2021</risdate><abstract>A method of manufacturing a via hole, a method of manufacturing an array substrate and an array substrate are provided. The method of manufacturing an via hole includes: providing a base substrate; forming an insulation layer on the base substrate; etching the insulation layer by using a first etching process to forma groove in the insulation layer; performing an ion implantation process with ions on a portion of the insulation layer exposed by the groove to form an ion implantation region; and etching a portion of the insulation layer in the ion implantation region by using a second etching process to form a via hole penetrating the insulation layer.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_epo_espacenet_US11054707B2 |
source | esp@cenet |
subjects | BASIC ELECTRIC ELEMENTS DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS SEMICONDUCTOR DEVICES TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF |
title | Method of manufacturing via hole, method of manufacturing array substrate, and array substrate |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-03T14%3A16%3A57IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Gong,%20Kui&rft.date=2021-07-06&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS11054707B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |