Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection

A interposer sandwich structure comprises a top interposer and a bottom interposer enclosing an integrated circuit electronic device that includes means for attaching the device to the bottom interposer, and an interconnection structure connecting the top interposer to the bottom interposer. The top...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Dang, Bing, Interrante, Mario J, Knickerbocker, John, Tran, Son Kim, Bernier, William Emmett
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!