Semiconductor device and a semiconductor package including the same

A semiconductor device includes an internal circuit in a core region, a first protection circuit in a peripheral region surrounding the core region, the first protection circuit including first and second protection sections and a first fuse, and a first pad receiving a first signal. The first pad i...

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description A semiconductor device includes an internal circuit in a core region, a first protection circuit in a peripheral region surrounding the core region, the first protection circuit including first and second protection sections and a first fuse, and a first pad receiving a first signal. The first pad is electrically connected to the first protection section via the first fuse, and the first pad is electrically connected to the second protection section. The internal circuit is electrically connected to the first pad through the second protection section. When a surge voltage having a magnitude equal to or larger than a predetermined voltage is input to the first pad, each of the first and second protection sections prevent the surge voltage from being applied into the internal circuit.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11043805B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11043805B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11043805B23</originalsourceid><addsrcrecordid>eNrjZHAOTs3NTM7PSylNLskvUkhJLctMTlVIzEtRSFQoRpEqSEzOTkxPVcjMS84pTcnMS1coyUhVKE7MTeVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFQI2peakl8aHBhoYGJsYWBqZORsbEqAEAjbcynA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Semiconductor device and a semiconductor package including the same</title><source>esp@cenet</source><creator>Kim, Jang Hoo</creator><creatorcontrib>Kim, Jang Hoo</creatorcontrib><description>A semiconductor device includes an internal circuit in a core region, a first protection circuit in a peripheral region surrounding the core region, the first protection circuit including first and second protection sections and a first fuse, and a first pad receiving a first signal. The first pad is electrically connected to the first protection section via the first fuse, and the first pad is electrically connected to the second protection section. The internal circuit is electrically connected to the first pad through the second protection section. When a surge voltage having a magnitude equal to or larger than a predetermined voltage is input to the first pad, each of the first and second protection sections prevent the surge voltage from being applied into the internal circuit.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS ; GENERATION ; SEMICONDUCTOR DEVICES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210622&amp;DB=EPODOC&amp;CC=US&amp;NR=11043805B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210622&amp;DB=EPODOC&amp;CC=US&amp;NR=11043805B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Kim, Jang Hoo</creatorcontrib><title>Semiconductor device and a semiconductor package including the same</title><description>A semiconductor device includes an internal circuit in a core region, a first protection circuit in a peripheral region surrounding the core region, the first protection circuit including first and second protection sections and a first fuse, and a first pad receiving a first signal. The first pad is electrically connected to the first protection section via the first fuse, and the first pad is electrically connected to the second protection section. The internal circuit is electrically connected to the first pad through the second protection section. When a surge voltage having a magnitude equal to or larger than a predetermined voltage is input to the first pad, each of the first and second protection sections prevent the surge voltage from being applied into the internal circuit.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS</subject><subject>GENERATION</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAOTs3NTM7PSylNLskvUkhJLctMTlVIzEtRSFQoRpEqSEzOTkxPVcjMS84pTcnMS1coyUhVKE7MTeVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFQI2peakl8aHBhoYGJsYWBqZORsbEqAEAjbcynA</recordid><startdate>20210622</startdate><enddate>20210622</enddate><creator>Kim, Jang Hoo</creator><scope>EVB</scope></search><sort><creationdate>20210622</creationdate><title>Semiconductor device and a semiconductor package including the same</title><author>Kim, Jang Hoo</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11043805B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS</topic><topic>GENERATION</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Kim, Jang Hoo</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Kim, Jang Hoo</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Semiconductor device and a semiconductor package including the same</title><date>2021-06-22</date><risdate>2021</risdate><abstract>A semiconductor device includes an internal circuit in a core region, a first protection circuit in a peripheral region surrounding the core region, the first protection circuit including first and second protection sections and a first fuse, and a first pad receiving a first signal. The first pad is electrically connected to the first protection section via the first fuse, and the first pad is electrically connected to the second protection section. The internal circuit is electrically connected to the first pad through the second protection section. When a surge voltage having a magnitude equal to or larger than a predetermined voltage is input to the first pad, each of the first and second protection sections prevent the surge voltage from being applied into the internal circuit.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
GENERATION
SEMICONDUCTOR DEVICES
title Semiconductor device and a semiconductor package including the same
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-31T20%3A59%3A39IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Kim,%20Jang%20Hoo&rft.date=2021-06-22&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS11043805B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true