Acidic aqueous composition for electrolytic copper plating

The present invention relates to an acidic aqueous composition (plating bath) for electrolytic copper plating (electrolytic deposition of copper), the composition comprising(i) copper (II) ions,(ii) one or more than one compound of Formula (Ia)(iii) one, two, three or more than three further compoun...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Palm, Jens, Bolton, Onas, Schmidt, Ralf, Rohde, Dirk, Mann, Olivier, Llavona-Serrano, Angela, Von Horsten, Frank, Jha, Himendra, Si, Kun, Gaida, Josef
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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