Semiconductor device having a flat region with an outer peripheral shape including chamfer portions
Provided is a semiconductor device capable of improving relative accuracy of semiconductor elements and a yield of a semiconductor integrated circuit device. The semiconductor device includes a flat region formed on a surface of a semiconductor substrate, and having an outer peripheral shape formed...
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creator | Takasu, Hiroaki |
description | Provided is a semiconductor device capable of improving relative accuracy of semiconductor elements and a yield of a semiconductor integrated circuit device. The semiconductor device includes a flat region formed on a surface of a semiconductor substrate, and having an outer peripheral shape formed by regional sides and regional chamfer portions; an outer peripheral region surrounding the flat region, and having a uniform height different from a height of the flat region; a plurality of semiconductor elements having similar shapes or the same shape, and formed on the flat region; and a wiring metal connecting the plurality of semiconductor elements via contact holes formed in a second insulating film on the semiconductor elements. |
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The semiconductor device includes a flat region formed on a surface of a semiconductor substrate, and having an outer peripheral shape formed by regional sides and regional chamfer portions; an outer peripheral region surrounding the flat region, and having a uniform height different from a height of the flat region; a plurality of semiconductor elements having similar shapes or the same shape, and formed on the flat region; and a wiring metal connecting the plurality of semiconductor elements via contact holes formed in a second insulating film on the semiconductor elements.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyzEOwjAQBdE0FAi4w3IApBgoqEEg-kCNVpufeCXHtmwnXB8icQCqad4sK2kwqATfjlJCohaTCsjypL4nps5xoYReg6e3FkvsKYwFiSKSRovEjrLlCFIvbmznTSwP3UxCKt8xr6tFxy5j8-uq2t6uj8t9hxheyJEFHuX1bIypjTme6vP-8I_5AMDjPt4</recordid><startdate>20210518</startdate><enddate>20210518</enddate><creator>Takasu, Hiroaki</creator><scope>EVB</scope></search><sort><creationdate>20210518</creationdate><title>Semiconductor device having a flat region with an outer peripheral shape including chamfer portions</title><author>Takasu, Hiroaki</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11011480B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Takasu, Hiroaki</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Takasu, Hiroaki</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Semiconductor device having a flat region with an outer peripheral shape including chamfer portions</title><date>2021-05-18</date><risdate>2021</risdate><abstract>Provided is a semiconductor device capable of improving relative accuracy of semiconductor elements and a yield of a semiconductor integrated circuit device. The semiconductor device includes a flat region formed on a surface of a semiconductor substrate, and having an outer peripheral shape formed by regional sides and regional chamfer portions; an outer peripheral region surrounding the flat region, and having a uniform height different from a height of the flat region; a plurality of semiconductor elements having similar shapes or the same shape, and formed on the flat region; and a wiring metal connecting the plurality of semiconductor elements via contact holes formed in a second insulating film on the semiconductor elements.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Semiconductor device having a flat region with an outer peripheral shape including chamfer portions |
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