Apparatus and method inspecting bonded semiconductor dice

An apparatus for inspecting a semiconductor die bonded on a top surface of a substrate uses an optical assembly including an image sensor and an optical system for conducting the inspection. The optical assembly is tilted at an oblique angle with respect to the top surface of the substrate, and is a...

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Bibliographische Detailangaben
Hauptverfasser:	Chow, Lap Kei, Sze, Wui Fung, Deng, Jiangwen
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GYROSCOPIC INSTRUMENTS MEASURING MEASURING ANGLES MEASURING AREAS MEASURING DISTANCES, LEVELS OR BEARINGS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS NAVIGATION PHOTOGRAMMETRY OR VIDEOGRAMMETRY PHYSICS SEMICONDUCTOR DEVICES SURVEYING TESTING
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