Method of processing a substrate
The invention relates to a method of processing a substrate. The substrate has one side and a side opposite to the one side. The substrate has, on the one side or on the side opposite to the one side, at least one recess. The method comprises providing a protective film and applying the protective f...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The invention relates to a method of processing a substrate. The substrate has one side and a side opposite to the one side. The substrate has, on the one side or on the side opposite to the one side, at least one recess. The method comprises providing a protective film and applying the protective film to the side of the substrate having the at least one recess so that at least a central area of a front surface of the protective film is in direct contact with the side of the substrate having the at least one recess. The method further comprises applying pressure to the protective film so that the protective film enters into the at least one recess along at least part of a depth of the recess, and processing the one side of the substrate and/or the side of the substrate opposite to the one side. |
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