Laying die, laying device and method for manufacturing a laying die
A laying die, for picking up and laying of substrates, comprising an elastically deformable substrate receiving structure providing an engagement surface for releasable receiving of substrates, an attaching element comprising a gas channel for providing positively or negatively pressurized gas for p...
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| creator | Akif, Öztzan Coquel, Maxime |
| description | A laying die, for picking up and laying of substrates, comprising an elastically deformable substrate receiving structure providing an engagement surface for releasable receiving of substrates, an attaching element comprising a gas channel for providing positively or negatively pressurized gas for picking up and blowing off the substrates, and a carrier body made from elastically deformable material and sandwiched between the substrate receiving structure and the attaching element which is arranged to distribute the positively or negatively pressurized gas over the carrier body. The carrier body comprises breakthroughs to transfer the pressurized gas from the attaching element to the substrate receiving structure that comprises an elastically deformable distribution plate to distribute the positively or negatively pressurized gas over the engagement surface. Also, a laying device which changes the position and/or orientation of substrates to predetermined values can comprise the laying die and a method for manufacturing the laying die. |
| format | Patent |
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The carrier body comprises breakthroughs to transfer the pressurized gas from the attaching element to the substrate receiving structure that comprises an elastically deformable distribution plate to distribute the positively or negatively pressurized gas over the engagement surface. Also, a laying device which changes the position and/or orientation of substrates to predetermined values can comprise the laying die and a method for manufacturing the laying die.</description><language>eng</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; MAKING GRANULES OR PREFORMS ; PERFORMING OPERATIONS ; PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED ; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210518&DB=EPODOC&CC=US&NR=11007729B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210518&DB=EPODOC&CC=US&NR=11007729B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Akif, Öztzan</creatorcontrib><creatorcontrib>Coquel, Maxime</creatorcontrib><title>Laying die, laying device and method for manufacturing a laying die</title><description>A laying die, for picking up and laying of substrates, comprising an elastically deformable substrate receiving structure providing an engagement surface for releasable receiving of substrates, an attaching element comprising a gas channel for providing positively or negatively pressurized gas for picking up and blowing off the substrates, and a carrier body made from elastically deformable material and sandwiched between the substrate receiving structure and the attaching element which is arranged to distribute the positively or negatively pressurized gas over the carrier body. The carrier body comprises breakthroughs to transfer the pressurized gas from the attaching element to the substrate receiving structure that comprises an elastically deformable distribution plate to distribute the positively or negatively pressurized gas over the engagement surface. Also, a laying device which changes the position and/or orientation of substrates to predetermined values can comprise the laying die and a method for manufacturing the laying die.</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>MAKING GRANULES OR PREFORMS</subject><subject>PERFORMING OPERATIONS</subject><subject>PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED</subject><subject>RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD2SazMzEtXSMlM1VHIgbJTyzKTUxUS81IUclNLMvJTFNLyixRyE_NK0xKTS0qLQGoS4YozU3kYWNMSc4pTeaE0N4Oim2uIs4duakF-fGpxQWJyal5qSXxosKGhgYG5uZGlk5ExMWoAGzkx0A</recordid><startdate>20210518</startdate><enddate>20210518</enddate><creator>Akif, Öztzan</creator><creator>Coquel, Maxime</creator><scope>EVB</scope></search><sort><creationdate>20210518</creationdate><title>Laying die, laying device and method for manufacturing a laying die</title><author>Akif, Öztzan ; Coquel, Maxime</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11007729B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>MAKING GRANULES OR PREFORMS</topic><topic>PERFORMING OPERATIONS</topic><topic>PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED</topic><topic>RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>Akif, Öztzan</creatorcontrib><creatorcontrib>Coquel, Maxime</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Akif, Öztzan</au><au>Coquel, Maxime</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Laying die, laying device and method for manufacturing a laying die</title><date>2021-05-18</date><risdate>2021</risdate><abstract>A laying die, for picking up and laying of substrates, comprising an elastically deformable substrate receiving structure providing an engagement surface for releasable receiving of substrates, an attaching element comprising a gas channel for providing positively or negatively pressurized gas for picking up and blowing off the substrates, and a carrier body made from elastically deformable material and sandwiched between the substrate receiving structure and the attaching element which is arranged to distribute the positively or negatively pressurized gas over the carrier body. The carrier body comprises breakthroughs to transfer the pressurized gas from the attaching element to the substrate receiving structure that comprises an elastically deformable distribution plate to distribute the positively or negatively pressurized gas over the engagement surface. Also, a laying device which changes the position and/or orientation of substrates to predetermined values can comprise the laying die and a method for manufacturing the laying die.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| source | esp@cenet |
| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING MAKING GRANULES OR PREFORMS PERFORMING OPERATIONS PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | Laying die, laying device and method for manufacturing a laying die |
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