Method of fabricating reticle
A method for exposing a wafer substrate includes forming a reticle having a device pattern. A relative orientation between the device pattern and a mask field of an exposure tool is determined based on mask field utilization. The reticle is loaded on the exposure tool. The wafer substrate is rotated...
Gespeichert in:
| Hauptverfasser: | , , , , , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | Liao, Chi-Hung Chung, Hsueh-Yi Chen, Yung-Cheng Fu, Shih-Chi Chang, Tzong-Sheng Hsu, Wei-Ti Chuang, Jui-Ping Tsai, Fei-Gwo Chen, Kuei-Shun Chen, Meng-Wei |
| description | A method for exposing a wafer substrate includes forming a reticle having a device pattern. A relative orientation between the device pattern and a mask field of an exposure tool is determined based on mask field utilization. The reticle is loaded on the exposure tool. The wafer substrate is rotated based on an orientation of the device pattern. Radiation is projected through the reticle onto the rotated wafer substrate by the exposure tool, thereby imaging the device pattern onto the rotated wafer substrate. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11003091B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11003091B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11003091B23</originalsourceid><addsrcrecordid>eNrjZJD1TS3JyE9RyE9TSEtMKspMTizJzEtXKEotyUzOSeVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfGhwYaGBgbGBpaGTkbGxKgBAL6uJA4</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method of fabricating reticle</title><source>esp@cenet</source><creator>Liao, Chi-Hung ; Chung, Hsueh-Yi ; Chen, Yung-Cheng ; Fu, Shih-Chi ; Chang, Tzong-Sheng ; Hsu, Wei-Ti ; Chuang, Jui-Ping ; Tsai, Fei-Gwo ; Chen, Kuei-Shun ; Chen, Meng-Wei</creator><creatorcontrib>Liao, Chi-Hung ; Chung, Hsueh-Yi ; Chen, Yung-Cheng ; Fu, Shih-Chi ; Chang, Tzong-Sheng ; Hsu, Wei-Ti ; Chuang, Jui-Ping ; Tsai, Fei-Gwo ; Chen, Kuei-Shun ; Chen, Meng-Wei</creatorcontrib><description>A method for exposing a wafer substrate includes forming a reticle having a device pattern. A relative orientation between the device pattern and a mask field of an exposure tool is determined based on mask field utilization. The reticle is loaded on the exposure tool. The wafer substrate is rotated based on an orientation of the device pattern. Radiation is projected through the reticle onto the rotated wafer substrate by the exposure tool, thereby imaging the device pattern onto the rotated wafer substrate.</description><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; BASIC ELECTRIC ELEMENTS ; CINEMATOGRAPHY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; SEMICONDUCTOR DEVICES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210511&DB=EPODOC&CC=US&NR=11003091B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210511&DB=EPODOC&CC=US&NR=11003091B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Liao, Chi-Hung</creatorcontrib><creatorcontrib>Chung, Hsueh-Yi</creatorcontrib><creatorcontrib>Chen, Yung-Cheng</creatorcontrib><creatorcontrib>Fu, Shih-Chi</creatorcontrib><creatorcontrib>Chang, Tzong-Sheng</creatorcontrib><creatorcontrib>Hsu, Wei-Ti</creatorcontrib><creatorcontrib>Chuang, Jui-Ping</creatorcontrib><creatorcontrib>Tsai, Fei-Gwo</creatorcontrib><creatorcontrib>Chen, Kuei-Shun</creatorcontrib><creatorcontrib>Chen, Meng-Wei</creatorcontrib><title>Method of fabricating reticle</title><description>A method for exposing a wafer substrate includes forming a reticle having a device pattern. A relative orientation between the device pattern and a mask field of an exposure tool is determined based on mask field utilization. The reticle is loaded on the exposure tool. The wafer substrate is rotated based on an orientation of the device pattern. Radiation is projected through the reticle onto the rotated wafer substrate by the exposure tool, thereby imaging the device pattern onto the rotated wafer substrate.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJD1TS3JyE9RyE9TSEtMKspMTizJzEtXKEotyUzOSeVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfGhwYaGBgbGBpaGTkbGxKgBAL6uJA4</recordid><startdate>20210511</startdate><enddate>20210511</enddate><creator>Liao, Chi-Hung</creator><creator>Chung, Hsueh-Yi</creator><creator>Chen, Yung-Cheng</creator><creator>Fu, Shih-Chi</creator><creator>Chang, Tzong-Sheng</creator><creator>Hsu, Wei-Ti</creator><creator>Chuang, Jui-Ping</creator><creator>Tsai, Fei-Gwo</creator><creator>Chen, Kuei-Shun</creator><creator>Chen, Meng-Wei</creator><scope>EVB</scope></search><sort><creationdate>20210511</creationdate><title>Method of fabricating reticle</title><author>Liao, Chi-Hung ; Chung, Hsueh-Yi ; Chen, Yung-Cheng ; Fu, Shih-Chi ; Chang, Tzong-Sheng ; Hsu, Wei-Ti ; Chuang, Jui-Ping ; Tsai, Fei-Gwo ; Chen, Kuei-Shun ; Chen, Meng-Wei</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11003091B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Liao, Chi-Hung</creatorcontrib><creatorcontrib>Chung, Hsueh-Yi</creatorcontrib><creatorcontrib>Chen, Yung-Cheng</creatorcontrib><creatorcontrib>Fu, Shih-Chi</creatorcontrib><creatorcontrib>Chang, Tzong-Sheng</creatorcontrib><creatorcontrib>Hsu, Wei-Ti</creatorcontrib><creatorcontrib>Chuang, Jui-Ping</creatorcontrib><creatorcontrib>Tsai, Fei-Gwo</creatorcontrib><creatorcontrib>Chen, Kuei-Shun</creatorcontrib><creatorcontrib>Chen, Meng-Wei</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Liao, Chi-Hung</au><au>Chung, Hsueh-Yi</au><au>Chen, Yung-Cheng</au><au>Fu, Shih-Chi</au><au>Chang, Tzong-Sheng</au><au>Hsu, Wei-Ti</au><au>Chuang, Jui-Ping</au><au>Tsai, Fei-Gwo</au><au>Chen, Kuei-Shun</au><au>Chen, Meng-Wei</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method of fabricating reticle</title><date>2021-05-11</date><risdate>2021</risdate><abstract>A method for exposing a wafer substrate includes forming a reticle having a device pattern. A relative orientation between the device pattern and a mask field of an exposure tool is determined based on mask field utilization. The reticle is loaded on the exposure tool. The wafer substrate is rotated based on an orientation of the device pattern. Radiation is projected through the reticle onto the rotated wafer substrate by the exposure tool, thereby imaging the device pattern onto the rotated wafer substrate.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US11003091B2 |
| source | esp@cenet |
| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES |
| title | Method of fabricating reticle |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-11T21%3A03%3A28IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Liao,%20Chi-Hung&rft.date=2021-05-11&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS11003091B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |