Surface treating apparatus

The film forming mechanism 110 ejects a continuous laminar liquid under pressure of about 0.01 MPa at a flow rate of 5 to 10 L/min. Such a liquid film prevents droplets reflected on a surface of an antiscattering member 60 from splashing and entering the adjacent treatment chamber. When a plate-like...

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Hauptverfasser: Utsumi, Masayuki, Takeuchi, Masaharu
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creator Utsumi, Masayuki
Takeuchi, Masaharu
description The film forming mechanism 110 ejects a continuous laminar liquid under pressure of about 0.01 MPa at a flow rate of 5 to 10 L/min. Such a liquid film prevents droplets reflected on a surface of an antiscattering member 60 from splashing and entering the adjacent treatment chamber. When a plate-like work 10 is shaken to collide with the liquid film, the film flows down along the plate-like work 10 since the film formed by the film forming mechanism 110 is liquid. Thereby, a shake of the plate-like work 10 is converged. An amount of air flowing in toward a transport direction in each treatment chamber is reduced.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11001928B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11001928B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11001928B23</originalsourceid><addsrcrecordid>eNrjZJAKLi1KS0xOVSgpSk0sycxLV0gsKEgsSiwpLeZhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBUBdeakl8aHBhoYGBoaWRhZORsbEqAEAYkEjWQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Surface treating apparatus</title><source>esp@cenet</source><creator>Utsumi, Masayuki ; Takeuchi, Masaharu</creator><creatorcontrib>Utsumi, Masayuki ; Takeuchi, Masaharu</creatorcontrib><description>The film forming mechanism 110 ejects a continuous laminar liquid under pressure of about 0.01 MPa at a flow rate of 5 to 10 L/min. Such a liquid film prevents droplets reflected on a surface of an antiscattering member 60 from splashing and entering the adjacent treatment chamber. When a plate-like work 10 is shaken to collide with the liquid film, the film flows down along the plate-like work 10 since the film formed by the film forming mechanism 110 is liquid. Thereby, a shake of the plate-like work 10 is converged. An amount of air flowing in toward a transport direction in each treatment chamber is reduced.</description><language>eng</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210511&amp;DB=EPODOC&amp;CC=US&amp;NR=11001928B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210511&amp;DB=EPODOC&amp;CC=US&amp;NR=11001928B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Utsumi, Masayuki</creatorcontrib><creatorcontrib>Takeuchi, Masaharu</creatorcontrib><title>Surface treating apparatus</title><description>The film forming mechanism 110 ejects a continuous laminar liquid under pressure of about 0.01 MPa at a flow rate of 5 to 10 L/min. Such a liquid film prevents droplets reflected on a surface of an antiscattering member 60 from splashing and entering the adjacent treatment chamber. When a plate-like work 10 is shaken to collide with the liquid film, the film flows down along the plate-like work 10 since the film formed by the film forming mechanism 110 is liquid. Thereby, a shake of the plate-like work 10 is converged. An amount of air flowing in toward a transport direction in each treatment chamber is reduced.</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAKLi1KS0xOVSgpSk0sycxLV0gsKEgsSiwpLeZhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBUBdeakl8aHBhoYGBoaWRhZORsbEqAEAYkEjWQ</recordid><startdate>20210511</startdate><enddate>20210511</enddate><creator>Utsumi, Masayuki</creator><creator>Takeuchi, Masaharu</creator><scope>EVB</scope></search><sort><creationdate>20210511</creationdate><title>Surface treating apparatus</title><author>Utsumi, Masayuki ; Takeuchi, Masaharu</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11001928B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>Utsumi, Masayuki</creatorcontrib><creatorcontrib>Takeuchi, Masaharu</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Utsumi, Masayuki</au><au>Takeuchi, Masaharu</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Surface treating apparatus</title><date>2021-05-11</date><risdate>2021</risdate><abstract>The film forming mechanism 110 ejects a continuous laminar liquid under pressure of about 0.01 MPa at a flow rate of 5 to 10 L/min. Such a liquid film prevents droplets reflected on a surface of an antiscattering member 60 from splashing and entering the adjacent treatment chamber. When a plate-like work 10 is shaken to collide with the liquid film, the film flows down along the plate-like work 10 since the film formed by the film forming mechanism 110 is liquid. Thereby, a shake of the plate-like work 10 is converged. An amount of air flowing in toward a transport direction in each treatment chamber is reduced.</abstract><oa>free_for_read</oa></addata></record>
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subjects CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
title Surface treating apparatus
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