Method of wire bonding a first and second circuit card

Method of wire bonding a first and second circuit card

Methods and apparatus for an assembly having first and second circuit cards mated together with a ball stack on the first circuit card extending into a through hole in the second circuit card. A wirebond connects the first ball stack to a bond pad on the first surface of the second circuit card form...

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Hauptverfasser: Beninati, Gregory G, Tellinghuisen, Thomas J, Hersey, Donald G, Benedict, James E, Pevzner, Mikhail
Format: Patent
Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator Beninati, Gregory G
Tellinghuisen, Thomas J
Hersey, Donald G
Benedict, James E
Pevzner, Mikhail
description Methods and apparatus for an assembly having first and second circuit cards mated together with a ball stack on the first circuit card extending into a through hole in the second circuit card. A wirebond connects the first ball stack to a bond pad on the first surface of the second circuit card forming a low profile connector-less interconnect. The ball stack comprises at least two balls stacked on top of each other and bonded to each other, wherein the balls are generated from wire.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10999938B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10999938B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10999938B13</originalsourceid><addsrcrecordid>eNrjZDDzTS3JyE9RyE9TKM8sSlVIys9LycxLV0hUSMssKi5RSMxLUShOTQaKKiRnFiWXZpYoJCcWpfAwsKYl5hSn8kJpbgZFN9cQZw_d1IL8-NTigsTk1LzUkvjQYEMDSyAwtnAyNCZGDQBPVy0i</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method of wire bonding a first and second circuit card</title><source>esp@cenet</source><creator>Beninati, Gregory G ; Tellinghuisen, Thomas J ; Hersey, Donald G ; Benedict, James E ; Pevzner, Mikhail</creator><creatorcontrib>Beninati, Gregory G ; Tellinghuisen, Thomas J ; Hersey, Donald G ; Benedict, James E ; Pevzner, Mikhail</creatorcontrib><description>Methods and apparatus for an assembly having first and second circuit cards mated together with a ball stack on the first circuit card extending into a through hole in the second circuit card. A wirebond connects the first ball stack to a bond pad on the first surface of the second circuit card forming a low profile connector-less interconnect. The ball stack comprises at least two balls stacked on top of each other and bonded to each other, wherein the balls are generated from wire.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210504&amp;DB=EPODOC&amp;CC=US&amp;NR=10999938B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210504&amp;DB=EPODOC&amp;CC=US&amp;NR=10999938B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Beninati, Gregory G</creatorcontrib><creatorcontrib>Tellinghuisen, Thomas J</creatorcontrib><creatorcontrib>Hersey, Donald G</creatorcontrib><creatorcontrib>Benedict, James E</creatorcontrib><creatorcontrib>Pevzner, Mikhail</creatorcontrib><title>Method of wire bonding a first and second circuit card</title><description>Methods and apparatus for an assembly having first and second circuit cards mated together with a ball stack on the first circuit card extending into a through hole in the second circuit card. A wirebond connects the first ball stack to a bond pad on the first surface of the second circuit card forming a low profile connector-less interconnect. The ball stack comprises at least two balls stacked on top of each other and bonded to each other, wherein the balls are generated from wire.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDDzTS3JyE9RyE9TKM8sSlVIys9LycxLV0hUSMssKi5RSMxLUShOTQaKKiRnFiWXZpYoJCcWpfAwsKYl5hSn8kJpbgZFN9cQZw_d1IL8-NTigsTk1LzUkvjQYEMDSyAwtnAyNCZGDQBPVy0i</recordid><startdate>20210504</startdate><enddate>20210504</enddate><creator>Beninati, Gregory G</creator><creator>Tellinghuisen, Thomas J</creator><creator>Hersey, Donald G</creator><creator>Benedict, James E</creator><creator>Pevzner, Mikhail</creator><scope>EVB</scope></search><sort><creationdate>20210504</creationdate><title>Method of wire bonding a first and second circuit card</title><author>Beninati, Gregory G ; Tellinghuisen, Thomas J ; Hersey, Donald G ; Benedict, James E ; Pevzner, Mikhail</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10999938B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>Beninati, Gregory G</creatorcontrib><creatorcontrib>Tellinghuisen, Thomas J</creatorcontrib><creatorcontrib>Hersey, Donald G</creatorcontrib><creatorcontrib>Benedict, James E</creatorcontrib><creatorcontrib>Pevzner, Mikhail</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Beninati, Gregory G</au><au>Tellinghuisen, Thomas J</au><au>Hersey, Donald G</au><au>Benedict, James E</au><au>Pevzner, Mikhail</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method of wire bonding a first and second circuit card</title><date>2021-05-04</date><risdate>2021</risdate><abstract>Methods and apparatus for an assembly having first and second circuit cards mated together with a ball stack on the first circuit card extending into a through hole in the second circuit card. A wirebond connects the first ball stack to a bond pad on the first surface of the second circuit card forming a low profile connector-less interconnect. The ball stack comprises at least two balls stacked on top of each other and bonded to each other, wherein the balls are generated from wire.</abstract><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Method of wire bonding a first and second circuit card
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-14T08%3A37%3A23IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Beninati,%20Gregory%20G&rft.date=2021-05-04&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS10999938B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true