Systems, methods, and devices for mechanical isolation or mechanical damping of microfabricated inertial sensors

MEMS-based sensors can experience undesirable signal frequencies caused by vibrations, shocks, and accelerations, among other phenomena. A microisolation system can isolate individual MEMS-based sensors from undesirable signal frequencies and shocks. An embodiment of a system for microisolation of a...

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Hauptverfasser: Kranz, Michael S, Dean, Jr., Robert Neal, Adams, Mark Lee, Bottenfield, Brent Douglas, English, Brian A, Bond, III, Arthur Gernt, Rudd, Carl
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creator Kranz, Michael S
Dean, Jr., Robert Neal
Adams, Mark Lee
Bottenfield, Brent Douglas
English, Brian A
Bond, III, Arthur Gernt
Rudd, Carl
description MEMS-based sensors can experience undesirable signal frequencies caused by vibrations, shocks, and accelerations, among other phenomena. A microisolation system can isolate individual MEMS-based sensors from undesirable signal frequencies and shocks. An embodiment of a system for microisolation of a MEMS-based sensor can include an isolation platform connected to one or more folded springs. Another embodiment of a system for microisolation can include an isolation platform and/or a frame connected to a mesh damping mechanism. In at least one embodiment, a mesh damping mechanism can be a microfibrous metal mesh damper. In one or more embodiments, a system for microisolation can include an isolation platform connected to one or more L-shaped springs, and a thickness of the one or more L-shaped springs can be less than a thickness of the isolation platform.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10988375B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10988375B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10988375B13</originalsourceid><addsrcrecordid>eNqNijELwjAQRrs4iPofzl3BUsS6Kop7dS5ncmkPmlzIBcF_bwYXN6fv8b03r2L31kxeN-Apj2ILYLBg6cWGFJykIsyIgQ1OwCoTZpYAv79FHzkMIA48myQOn6mITBY4UMpcGqWgknRZzRxOSqvvLqr19XI_37YUpSeNaChQ7h9dvTu2bXPYn-rmn-YDXlhD0g</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Systems, methods, and devices for mechanical isolation or mechanical damping of microfabricated inertial sensors</title><source>esp@cenet</source><creator>Kranz, Michael S ; Dean, Jr., Robert Neal ; Adams, Mark Lee ; Bottenfield, Brent Douglas ; English, Brian A ; Bond, III, Arthur Gernt ; Rudd, Carl</creator><creatorcontrib>Kranz, Michael S ; Dean, Jr., Robert Neal ; Adams, Mark Lee ; Bottenfield, Brent Douglas ; English, Brian A ; Bond, III, Arthur Gernt ; Rudd, Carl</creatorcontrib><description>MEMS-based sensors can experience undesirable signal frequencies caused by vibrations, shocks, and accelerations, among other phenomena. A microisolation system can isolate individual MEMS-based sensors from undesirable signal frequencies and shocks. An embodiment of a system for microisolation of a MEMS-based sensor can include an isolation platform connected to one or more folded springs. Another embodiment of a system for microisolation can include an isolation platform and/or a frame connected to a mesh damping mechanism. In at least one embodiment, a mesh damping mechanism can be a microfibrous metal mesh damper. In one or more embodiments, a system for microisolation can include an isolation platform connected to one or more L-shaped springs, and a thickness of the one or more L-shaped springs can be less than a thickness of the isolation platform.</description><language>eng</language><subject>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES ; MICROSTRUCTURAL TECHNOLOGY ; PERFORMING OPERATIONS ; TRANSPORTING</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210427&amp;DB=EPODOC&amp;CC=US&amp;NR=10988375B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210427&amp;DB=EPODOC&amp;CC=US&amp;NR=10988375B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Kranz, Michael S</creatorcontrib><creatorcontrib>Dean, Jr., Robert Neal</creatorcontrib><creatorcontrib>Adams, Mark Lee</creatorcontrib><creatorcontrib>Bottenfield, Brent Douglas</creatorcontrib><creatorcontrib>English, Brian A</creatorcontrib><creatorcontrib>Bond, III, Arthur Gernt</creatorcontrib><creatorcontrib>Rudd, Carl</creatorcontrib><title>Systems, methods, and devices for mechanical isolation or mechanical damping of microfabricated inertial sensors</title><description>MEMS-based sensors can experience undesirable signal frequencies caused by vibrations, shocks, and accelerations, among other phenomena. A microisolation system can isolate individual MEMS-based sensors from undesirable signal frequencies and shocks. An embodiment of a system for microisolation of a MEMS-based sensor can include an isolation platform connected to one or more folded springs. Another embodiment of a system for microisolation can include an isolation platform and/or a frame connected to a mesh damping mechanism. In at least one embodiment, a mesh damping mechanism can be a microfibrous metal mesh damper. In one or more embodiments, a system for microisolation can include an isolation platform connected to one or more L-shaped springs, and a thickness of the one or more L-shaped springs can be less than a thickness of the isolation platform.</description><subject>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</subject><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>PERFORMING OPERATIONS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNijELwjAQRrs4iPofzl3BUsS6Kop7dS5ncmkPmlzIBcF_bwYXN6fv8b03r2L31kxeN-Apj2ILYLBg6cWGFJykIsyIgQ1OwCoTZpYAv79FHzkMIA48myQOn6mITBY4UMpcGqWgknRZzRxOSqvvLqr19XI_37YUpSeNaChQ7h9dvTu2bXPYn-rmn-YDXlhD0g</recordid><startdate>20210427</startdate><enddate>20210427</enddate><creator>Kranz, Michael S</creator><creator>Dean, Jr., Robert Neal</creator><creator>Adams, Mark Lee</creator><creator>Bottenfield, Brent Douglas</creator><creator>English, Brian A</creator><creator>Bond, III, Arthur Gernt</creator><creator>Rudd, Carl</creator><scope>EVB</scope></search><sort><creationdate>20210427</creationdate><title>Systems, methods, and devices for mechanical isolation or mechanical damping of microfabricated inertial sensors</title><author>Kranz, Michael S ; Dean, Jr., Robert Neal ; Adams, Mark Lee ; Bottenfield, Brent Douglas ; English, Brian A ; Bond, III, Arthur Gernt ; Rudd, Carl</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10988375B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</topic><topic>MICROSTRUCTURAL TECHNOLOGY</topic><topic>PERFORMING OPERATIONS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>Kranz, Michael S</creatorcontrib><creatorcontrib>Dean, Jr., Robert Neal</creatorcontrib><creatorcontrib>Adams, Mark Lee</creatorcontrib><creatorcontrib>Bottenfield, Brent Douglas</creatorcontrib><creatorcontrib>English, Brian A</creatorcontrib><creatorcontrib>Bond, III, Arthur Gernt</creatorcontrib><creatorcontrib>Rudd, Carl</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Kranz, Michael S</au><au>Dean, Jr., Robert Neal</au><au>Adams, Mark Lee</au><au>Bottenfield, Brent Douglas</au><au>English, Brian A</au><au>Bond, III, Arthur Gernt</au><au>Rudd, Carl</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Systems, methods, and devices for mechanical isolation or mechanical damping of microfabricated inertial sensors</title><date>2021-04-27</date><risdate>2021</risdate><abstract>MEMS-based sensors can experience undesirable signal frequencies caused by vibrations, shocks, and accelerations, among other phenomena. A microisolation system can isolate individual MEMS-based sensors from undesirable signal frequencies and shocks. An embodiment of a system for microisolation of a MEMS-based sensor can include an isolation platform connected to one or more folded springs. Another embodiment of a system for microisolation can include an isolation platform and/or a frame connected to a mesh damping mechanism. In at least one embodiment, a mesh damping mechanism can be a microfibrous metal mesh damper. In one or more embodiments, a system for microisolation can include an isolation platform connected to one or more L-shaped springs, and a thickness of the one or more L-shaped springs can be less than a thickness of the isolation platform.</abstract><oa>free_for_read</oa></addata></record>
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subjects MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
TRANSPORTING
title Systems, methods, and devices for mechanical isolation or mechanical damping of microfabricated inertial sensors
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