Method and device for cutting sapphire

A method for cutting sapphire comprising a sapphire body and a coating formed on the sapphire body, the method comprising: focusing a first CO2 laser beam the coating via a CO2 focusing assembly to remove the coating with a predetermined thickness extending along a first path; wherein dust and debri...

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Bibliographische Detailangaben
Hauptverfasser: Yuan, Xuerui, Yin, Jiangang, Gao, Yunfeng, Lu, Jiangang, Zhang, Xiaojun, Diao, Lingtian, Tang, Jiangang, Liu, Xiao, Ma, Guodong, Peng, Yuguo
Format: Patent
Sprache:eng
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