Heat transfer devices and methods of transfering heat
Heat transfer devices, electronic devices, and methods for heat transfer with an external body. Heat transfer devices include a first disc, a second disc positioned adjacent to the first disc, and at least one spacer positioned between the first disc and the second disc. The first disc defines an ap...
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creator | Kowell, Robert Stephen Veto, Christopher C Bunch, Ernest E |
description | Heat transfer devices, electronic devices, and methods for heat transfer with an external body. Heat transfer devices include a first disc, a second disc positioned adjacent to the first disc, and at least one spacer positioned between the first disc and the second disc. The first disc defines an aperture and comprises a pin cooling structure extending from around the aperture. The pin cooling structure comprises a distal end configured to facilitate heat exchange between the pin cooling structure and an external/adjacent/separate body and one or more side walls. At least one of the one or more side walls, the distal end, and the aperture at least partially define a pin volume. The second disc defines an inlet that is configured to (i) receive a fluid, and (ii) allow the fluid to flow from the inlet and into the pin volume. |
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Heat transfer devices include a first disc, a second disc positioned adjacent to the first disc, and at least one spacer positioned between the first disc and the second disc. The first disc defines an aperture and comprises a pin cooling structure extending from around the aperture. The pin cooling structure comprises a distal end configured to facilitate heat exchange between the pin cooling structure and an external/adjacent/separate body and one or more side walls. At least one of the one or more side walls, the distal end, and the aperture at least partially define a pin volume. 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The second disc defines an inlet that is configured to (i) receive a fluid, and (ii) allow the fluid to flow from the inlet and into the pin volume.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEAT EXCHANGE IN GENERAL</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MECHANICAL ENGINEERING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDD1SE0sUSgpSswrTkstUkhJLctMTi1WSMxLUchNLcnITylWyE-Dy2fmpStkADXwMLCmJeYUp_JCaW4GRTfXEGcP3dSC_PjU4oLE5NS81JL40GBDA0tzM0NDSycjY2LUAABbzC0_</recordid><startdate>20210413</startdate><enddate>20210413</enddate><creator>Kowell, Robert Stephen</creator><creator>Veto, Christopher C</creator><creator>Bunch, Ernest E</creator><scope>EVB</scope></search><sort><creationdate>20210413</creationdate><title>Heat transfer devices and methods of transfering heat</title><author>Kowell, Robert Stephen ; Veto, Christopher C ; Bunch, Ernest E</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10976119B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEAT EXCHANGE IN GENERAL</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MECHANICAL ENGINEERING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>Kowell, Robert Stephen</creatorcontrib><creatorcontrib>Veto, Christopher C</creatorcontrib><creatorcontrib>Bunch, Ernest E</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Kowell, Robert Stephen</au><au>Veto, Christopher C</au><au>Bunch, Ernest E</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Heat transfer devices and methods of transfering heat</title><date>2021-04-13</date><risdate>2021</risdate><abstract>Heat transfer devices, electronic devices, and methods for heat transfer with an external body. Heat transfer devices include a first disc, a second disc positioned adjacent to the first disc, and at least one spacer positioned between the first disc and the second disc. The first disc defines an aperture and comprises a pin cooling structure extending from around the aperture. The pin cooling structure comprises a distal end configured to facilitate heat exchange between the pin cooling structure and an external/adjacent/separate body and one or more side walls. At least one of the one or more side walls, the distal end, and the aperture at least partially define a pin volume. The second disc defines an inlet that is configured to (i) receive a fluid, and (ii) allow the fluid to flow from the inlet and into the pin volume.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS BLASTING DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEATING LIGHTING MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES WEAPONS |
title | Heat transfer devices and methods of transfering heat |
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