Three-dimensional semiconductor memory devices and methods of fabricating the same

Integrated circuit devices and methods of forming the same are provided. The devices may include a substrate including a cell region and an extension region and conductive layers stacked on the cell region in a vertical direction. The conductive layers may extend onto the extension region and may ha...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Jang, Daehyun, Min, Jae Ho, Kim, Minhyuk, Son, Yong-Hoon, Ahn, Sung-Soo
Format: Patent
Sprache:eng
Schlagworte:
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