Pre-fabricated sensor system including removable electronics device
A removable electronics device and related pre-fabricated sensor assemblies having different sensor layouts are provided. The removable electronics module includes one or more processors, an inertial measurement unit, a first communication interface configured to communicatively couple the removable...
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| creator | Gutierrez Bravo, Mauricio E Kauffmann, Alejandro Karagozler, Mustafa Emre Sundara-Rajan, Kishore Poupyrev, Ivan |
| description | A removable electronics device and related pre-fabricated sensor assemblies having different sensor layouts are provided. The removable electronics module includes one or more processors, an inertial measurement unit, a first communication interface configured to communicatively couple the removable electronics device to one or more computing devices, a second communication interface configured to communicatively couple the removable electronics device to a plurality of pre-fabricated sensor assemblies, and a housing at least partially enclosing the processor, the inertial measurement unit, the first communication interface, and the second communication interface. The housing includes a first opening in at least one longitudinal surface and adjacent to at least a portion of the first communication interface and a plurality of second openings in a lower surface and adjacent to the plurality of contact pads of the second communication interface. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10963106B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10963106B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10963106B23</originalsourceid><addsrcrecordid>eNqNyrEKwjAQBuAsDlJ9h_MBCq2FgqvF4iioc0kvfyWQJuUuFnx7Fx_A6Vu-relugnKyo3i2GY4UUZOQfjRjJh85vJ2PLxLMabVjACGAs6ToWclh9Yyd2Uw2KPY_C3PoL4_uWmJJA3SxjIg8PO91dWqbumrPx-af8wXE4TMv</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Pre-fabricated sensor system including removable electronics device</title><source>esp@cenet</source><creator>Gutierrez Bravo, Mauricio E ; Kauffmann, Alejandro ; Karagozler, Mustafa Emre ; Sundara-Rajan, Kishore ; Poupyrev, Ivan</creator><creatorcontrib>Gutierrez Bravo, Mauricio E ; Kauffmann, Alejandro ; Karagozler, Mustafa Emre ; Sundara-Rajan, Kishore ; Poupyrev, Ivan</creatorcontrib><description>A removable electronics device and related pre-fabricated sensor assemblies having different sensor layouts are provided. The removable electronics module includes one or more processors, an inertial measurement unit, a first communication interface configured to communicatively couple the removable electronics device to one or more computing devices, a second communication interface configured to communicatively couple the removable electronics device to a plurality of pre-fabricated sensor assemblies, and a housing at least partially enclosing the processor, the inertial measurement unit, the first communication interface, and the second communication interface. The housing includes a first opening in at least one longitudinal surface and adjacent to at least a portion of the first communication interface and a plurality of second openings in a lower surface and adjacent to the plurality of contact pads of the second communication interface.</description><language>eng</language><subject>CALCULATING ; COMPUTING ; COUNTING ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRICITY ; MEASURING ; PHYSICS ; TESTING ; TESTING STATIC OR DYNAMIC BALANCE OF MACHINES ORSTRUCTURES ; TESTING STRUCTURES OR APPARATUS NOT OTHERWISE PROVIDED FOR ; TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHICCOMMUNICATION</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210330&DB=EPODOC&CC=US&NR=10963106B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210330&DB=EPODOC&CC=US&NR=10963106B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Gutierrez Bravo, Mauricio E</creatorcontrib><creatorcontrib>Kauffmann, Alejandro</creatorcontrib><creatorcontrib>Karagozler, Mustafa Emre</creatorcontrib><creatorcontrib>Sundara-Rajan, Kishore</creatorcontrib><creatorcontrib>Poupyrev, Ivan</creatorcontrib><title>Pre-fabricated sensor system including removable electronics device</title><description>A removable electronics device and related pre-fabricated sensor assemblies having different sensor layouts are provided. The removable electronics module includes one or more processors, an inertial measurement unit, a first communication interface configured to communicatively couple the removable electronics device to one or more computing devices, a second communication interface configured to communicatively couple the removable electronics device to a plurality of pre-fabricated sensor assemblies, and a housing at least partially enclosing the processor, the inertial measurement unit, the first communication interface, and the second communication interface. The housing includes a first opening in at least one longitudinal surface and adjacent to at least a portion of the first communication interface and a plurality of second openings in a lower surface and adjacent to the plurality of contact pads of the second communication interface.</description><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRICITY</subject><subject>MEASURING</subject><subject>PHYSICS</subject><subject>TESTING</subject><subject>TESTING STATIC OR DYNAMIC BALANCE OF MACHINES ORSTRUCTURES</subject><subject>TESTING STRUCTURES OR APPARATUS NOT OTHERWISE PROVIDED FOR</subject><subject>TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHICCOMMUNICATION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAQBuAsDlJ9h_MBCq2FgqvF4iioc0kvfyWQJuUuFnx7Fx_A6Vu-relugnKyo3i2GY4UUZOQfjRjJh85vJ2PLxLMabVjACGAs6ToWclh9Yyd2Uw2KPY_C3PoL4_uWmJJA3SxjIg8PO91dWqbumrPx-af8wXE4TMv</recordid><startdate>20210330</startdate><enddate>20210330</enddate><creator>Gutierrez Bravo, Mauricio E</creator><creator>Kauffmann, Alejandro</creator><creator>Karagozler, Mustafa Emre</creator><creator>Sundara-Rajan, Kishore</creator><creator>Poupyrev, Ivan</creator><scope>EVB</scope></search><sort><creationdate>20210330</creationdate><title>Pre-fabricated sensor system including removable electronics device</title><author>Gutierrez Bravo, Mauricio E ; Kauffmann, Alejandro ; Karagozler, Mustafa Emre ; Sundara-Rajan, Kishore ; Poupyrev, Ivan</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10963106B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRICITY</topic><topic>MEASURING</topic><topic>PHYSICS</topic><topic>TESTING</topic><topic>TESTING STATIC OR DYNAMIC BALANCE OF MACHINES ORSTRUCTURES</topic><topic>TESTING STRUCTURES OR APPARATUS NOT OTHERWISE PROVIDED FOR</topic><topic>TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHICCOMMUNICATION</topic><toplevel>online_resources</toplevel><creatorcontrib>Gutierrez Bravo, Mauricio E</creatorcontrib><creatorcontrib>Kauffmann, Alejandro</creatorcontrib><creatorcontrib>Karagozler, Mustafa Emre</creatorcontrib><creatorcontrib>Sundara-Rajan, Kishore</creatorcontrib><creatorcontrib>Poupyrev, Ivan</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Gutierrez Bravo, Mauricio E</au><au>Kauffmann, Alejandro</au><au>Karagozler, Mustafa Emre</au><au>Sundara-Rajan, Kishore</au><au>Poupyrev, Ivan</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Pre-fabricated sensor system including removable electronics device</title><date>2021-03-30</date><risdate>2021</risdate><abstract>A removable electronics device and related pre-fabricated sensor assemblies having different sensor layouts are provided. The removable electronics module includes one or more processors, an inertial measurement unit, a first communication interface configured to communicatively couple the removable electronics device to one or more computing devices, a second communication interface configured to communicatively couple the removable electronics device to a plurality of pre-fabricated sensor assemblies, and a housing at least partially enclosing the processor, the inertial measurement unit, the first communication interface, and the second communication interface. The housing includes a first opening in at least one longitudinal surface and adjacent to at least a portion of the first communication interface and a plurality of second openings in a lower surface and adjacent to the plurality of contact pads of the second communication interface.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CALCULATING COMPUTING COUNTING ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC DIGITAL DATA PROCESSING ELECTRICITY MEASURING PHYSICS TESTING TESTING STATIC OR DYNAMIC BALANCE OF MACHINES ORSTRUCTURES TESTING STRUCTURES OR APPARATUS NOT OTHERWISE PROVIDED FOR TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHICCOMMUNICATION |
| title | Pre-fabricated sensor system including removable electronics device |
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