Thin film wafer transfer and structure for electronic devices

An electronic device includes a spreading layer and a first contact layer formed over and contacting the spreading layer. The first contact layer is formed from a thermally conductive crystalline material having a thermal conductivity greater than or equal to that of an active layer material. An act...

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Bibliographische Detailangaben

Hauptverfasser:	Chu, Jack O, Dimitrakopoulos, Christos, Sadana, Devendra K, Bayram, Can, Park, Hongsik, Kim, Jeehwan
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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