Temperature sensor
A temperature sensor of the present invention includes a sensor element (11) that includes a main body (13) and paired lead wires (15 and 15) drawn from the main body (13), and a first housing (19) that includes a resin mold layer and covers the sensor element (11). The main body (13) is partially o...
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| creator | Kirihara, Masanori Takemura, Michiru Yoshihara, Takamasa |
| description | A temperature sensor of the present invention includes a sensor element (11) that includes a main body (13) and paired lead wires (15 and 15) drawn from the main body (13), and a first housing (19) that includes a resin mold layer and covers the sensor element (11). The main body (13) is partially or entirely exposed, continuously in a circumferential direction, from the first housing (19) without being covered with the first housing. In the temperature sensor, the main body (13) includes a thermosensitive body (13A) and a sealing glass (13B) covering the thermosensitive body (13A), and the sealing glass (13B) is exposed from the first housing (19). |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10955296B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10955296B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10955296B23</originalsourceid><addsrcrecordid>eNrjZBAKSc0tSC1KLCktSlUoTs0rzi_iYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxocGGBpampkaWZk5GxsSoAQAbbCB_</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Temperature sensor</title><source>esp@cenet</source><creator>Kirihara, Masanori ; Takemura, Michiru ; Yoshihara, Takamasa</creator><creatorcontrib>Kirihara, Masanori ; Takemura, Michiru ; Yoshihara, Takamasa</creatorcontrib><description>A temperature sensor of the present invention includes a sensor element (11) that includes a main body (13) and paired lead wires (15 and 15) drawn from the main body (13), and a first housing (19) that includes a resin mold layer and covers the sensor element (11). The main body (13) is partially or entirely exposed, continuously in a circumferential direction, from the first housing (19) without being covered with the first housing. In the temperature sensor, the main body (13) includes a thermosensitive body (13A) and a sealing glass (13B) covering the thermosensitive body (13A), and the sealing glass (13B) is exposed from the first housing (19).</description><language>eng</language><subject>MEASURING ; MEASURING QUANTITY OF HEAT ; MEASURING TEMPERATURE ; PHYSICS ; TESTING ; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210323&DB=EPODOC&CC=US&NR=10955296B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210323&DB=EPODOC&CC=US&NR=10955296B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Kirihara, Masanori</creatorcontrib><creatorcontrib>Takemura, Michiru</creatorcontrib><creatorcontrib>Yoshihara, Takamasa</creatorcontrib><title>Temperature sensor</title><description>A temperature sensor of the present invention includes a sensor element (11) that includes a main body (13) and paired lead wires (15 and 15) drawn from the main body (13), and a first housing (19) that includes a resin mold layer and covers the sensor element (11). The main body (13) is partially or entirely exposed, continuously in a circumferential direction, from the first housing (19) without being covered with the first housing. In the temperature sensor, the main body (13) includes a thermosensitive body (13A) and a sealing glass (13B) covering the thermosensitive body (13A), and the sealing glass (13B) is exposed from the first housing (19).</description><subject>MEASURING</subject><subject>MEASURING QUANTITY OF HEAT</subject><subject>MEASURING TEMPERATURE</subject><subject>PHYSICS</subject><subject>TESTING</subject><subject>THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAKSc0tSC1KLCktSlUoTs0rzi_iYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxocGGBpampkaWZk5GxsSoAQAbbCB_</recordid><startdate>20210323</startdate><enddate>20210323</enddate><creator>Kirihara, Masanori</creator><creator>Takemura, Michiru</creator><creator>Yoshihara, Takamasa</creator><scope>EVB</scope></search><sort><creationdate>20210323</creationdate><title>Temperature sensor</title><author>Kirihara, Masanori ; Takemura, Michiru ; Yoshihara, Takamasa</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10955296B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>MEASURING</topic><topic>MEASURING QUANTITY OF HEAT</topic><topic>MEASURING TEMPERATURE</topic><topic>PHYSICS</topic><topic>TESTING</topic><topic>THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR</topic><toplevel>online_resources</toplevel><creatorcontrib>Kirihara, Masanori</creatorcontrib><creatorcontrib>Takemura, Michiru</creatorcontrib><creatorcontrib>Yoshihara, Takamasa</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Kirihara, Masanori</au><au>Takemura, Michiru</au><au>Yoshihara, Takamasa</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Temperature sensor</title><date>2021-03-23</date><risdate>2021</risdate><abstract>A temperature sensor of the present invention includes a sensor element (11) that includes a main body (13) and paired lead wires (15 and 15) drawn from the main body (13), and a first housing (19) that includes a resin mold layer and covers the sensor element (11). The main body (13) is partially or entirely exposed, continuously in a circumferential direction, from the first housing (19) without being covered with the first housing. In the temperature sensor, the main body (13) includes a thermosensitive body (13A) and a sealing glass (13B) covering the thermosensitive body (13A), and the sealing glass (13B) is exposed from the first housing (19).</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | MEASURING MEASURING QUANTITY OF HEAT MEASURING TEMPERATURE PHYSICS TESTING THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR |
| title | Temperature sensor |
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