Semiconductor device, power converter, and method for manufacturing semiconductor device

An object is to provide a technique for reducing process steps, and a stress generated at the peripheral portion of the joint portion between an electrode of a semiconductor element and a lead frame. A semiconductor device includes the following: a semiconductor element disposed on a heat spreader;...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Shirasawa, Takaaki, Kimoto, Nobuyoshi, Aiko, Mitsunori
Format: Patent
Sprache:eng
Schlagworte:
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