Semiconductor chip including a bump structure and semiconductor package including the same
A semiconductor chip includes a substrate having a low-k material layer. An electrode pad is disposed the substrate. A first protection layer at least partially surrounds the electrode pad. The first protection layer includes a first opening at an upper portion thereof. A buffer pad is electrically...
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| creator | Bae, Jin-Kuk Ryu, Han-Sung Lee, Chan-Ho Lee, In-Young Chung, Hyun-Soo |
| description | A semiconductor chip includes a substrate having a low-k material layer. An electrode pad is disposed the substrate. A first protection layer at least partially surrounds the electrode pad. The first protection layer includes a first opening at an upper portion thereof. A buffer pad is electrically connected to the electrode pad. A second protection layer at least partially surrounds the buffer pad. The second protection layer includes a second opening at an upper portion thereof. A pillar layer and a solder layer are sequentially stacked on the buffer pad. A thickness of the buffer pad is greater than a thickness of the electrode pad. A width of the first opening in a first direction parallel to an upper surface of the semiconductor substrate is equal to or greater than a width of the second opening in the first direction. |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Semiconductor chip including a bump structure and semiconductor package including the same |
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