Thermal processing susceptor

In one embodiment, a susceptor for thermal processing is provided. The susceptor includes an outer rim surrounding and coupled to an inner dish, the outer rim having an inner edge and an outer edge. The susceptor further includes one or more structures for reducing a contacting surface area between...

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Hauptverfasser: Mack, James Francis, Bautista, Kevin Joseph, Li, Xuebin, Ngo, Anhthu, Myo, Nyi O, Zhu, Zuoming, Cong, Zhepeng, Tong, Edric, Brillhart, Paul, Ramachandran, Balasubramanian, Shah, Kartik, Lo, Kin Pong, Huang, Yi-Chiau, Chang, Anzhong, Chu, Schubert S, Ye, Zhiyuan
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creator Mack, James Francis
Bautista, Kevin Joseph
Li, Xuebin
Ngo, Anhthu
Myo, Nyi O
Zhu, Zuoming
Cong, Zhepeng
Tong, Edric
Brillhart, Paul
Ramachandran, Balasubramanian
Shah, Kartik
Lo, Kin Pong
Huang, Yi-Chiau
Chang, Anzhong
Chu, Schubert S
Ye, Zhiyuan
description In one embodiment, a susceptor for thermal processing is provided. The susceptor includes an outer rim surrounding and coupled to an inner dish, the outer rim having an inner edge and an outer edge. The susceptor further includes one or more structures for reducing a contacting surface area between a substrate and the susceptor when the substrate is supported by the susceptor. At least one of the one or more structures is coupled to the inner dish proximate the inner edge of the outer rim.
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The susceptor includes an outer rim surrounding and coupled to an inner dish, the outer rim having an inner edge and an outer edge. The susceptor further includes one or more structures for reducing a contacting surface area between a substrate and the susceptor when the substrate is supported by the susceptor. 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Bautista, Kevin Joseph ; Li, Xuebin ; Ngo, Anhthu ; Myo, Nyi O ; Zhu, Zuoming ; Cong, Zhepeng ; Tong, Edric ; Brillhart, Paul ; Ramachandran, Balasubramanian ; Shah, Kartik ; Lo, Kin Pong ; Huang, Yi-Chiau ; Chang, Anzhong ; Chu, Schubert S ; Ye, Zhiyuan</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10930543B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUSPOLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE</topic><topic>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>APPARATUS THEREFOR</topic><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>CRYSTAL GROWTH</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE</topic><topic>REFINING BY ZONE-MELTING OF MATERIAL</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE</topic><topic>SINGLE-CRYSTAL-GROWTH</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><topic>TRANSPORTING</topic><topic>UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL ORUNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL</topic><toplevel>online_resources</toplevel><creatorcontrib>Mack, James Francis</creatorcontrib><creatorcontrib>Bautista, Kevin Joseph</creatorcontrib><creatorcontrib>Li, Xuebin</creatorcontrib><creatorcontrib>Ngo, Anhthu</creatorcontrib><creatorcontrib>Myo, Nyi O</creatorcontrib><creatorcontrib>Zhu, Zuoming</creatorcontrib><creatorcontrib>Cong, Zhepeng</creatorcontrib><creatorcontrib>Tong, Edric</creatorcontrib><creatorcontrib>Brillhart, Paul</creatorcontrib><creatorcontrib>Ramachandran, Balasubramanian</creatorcontrib><creatorcontrib>Shah, Kartik</creatorcontrib><creatorcontrib>Lo, Kin Pong</creatorcontrib><creatorcontrib>Huang, Yi-Chiau</creatorcontrib><creatorcontrib>Chang, Anzhong</creatorcontrib><creatorcontrib>Chu, Schubert S</creatorcontrib><creatorcontrib>Ye, Zhiyuan</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Mack, James Francis</au><au>Bautista, Kevin Joseph</au><au>Li, Xuebin</au><au>Ngo, Anhthu</au><au>Myo, Nyi O</au><au>Zhu, Zuoming</au><au>Cong, Zhepeng</au><au>Tong, Edric</au><au>Brillhart, Paul</au><au>Ramachandran, Balasubramanian</au><au>Shah, Kartik</au><au>Lo, Kin Pong</au><au>Huang, Yi-Chiau</au><au>Chang, Anzhong</au><au>Chu, Schubert S</au><au>Ye, Zhiyuan</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Thermal processing susceptor</title><date>2021-02-23</date><risdate>2021</risdate><abstract>In one embodiment, a susceptor for thermal processing is provided. The susceptor includes an outer rim surrounding and coupled to an inner dish, the outer rim having an inner edge and an outer edge. The susceptor further includes one or more structures for reducing a contacting surface area between a substrate and the susceptor when the substrate is supported by the susceptor. At least one of the one or more structures is coupled to the inner dish proximate the inner edge of the outer rim.</abstract><oa>free_for_read</oa></addata></record>
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subjects AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUSPOLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE
APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL
APPARATUS THEREFOR
APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
BASIC ELECTRIC ELEMENTS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
CRYSTAL GROWTH
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
PERFORMING OPERATIONS
PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE
REFINING BY ZONE-MELTING OF MATERIAL
SEMICONDUCTOR DEVICES
SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE
SINGLE-CRYSTAL-GROWTH
SPRAYING OR ATOMISING IN GENERAL
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
TRANSPORTING
UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL ORUNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL
title Thermal processing susceptor
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