Fan-out semiconductor package

A fan-out semiconductor package includes a connection member including an insulating layer and a redistribution layer, a semiconductor chip disposed on the connection member, an encapsulant encapsulating the semiconductor chip, and an electromagnetic wave shielding layer disposed on the semiconducto...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Park, Dae Hyun, Lee, Sang Jong, Lee, Seong Hwan, Han, Mi Ja
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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