Shower head, vapor phase growth apparatus and vapor phase growth method
A shower head that supplies a process gas in a vapor phase growth apparatus includes a mixing chamber; and a plurality of cooling portions provided below the mixing chamber with gaps between cooling portions. The cooling portion includes a cooling hole provided in a horizontal direction, and the gap...
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| creator | Sato, Yuusuke Yamada, Takumi |
| description | A shower head that supplies a process gas in a vapor phase growth apparatus includes a mixing chamber; and a plurality of cooling portions provided below the mixing chamber with gaps between cooling portions. The cooling portion includes a cooling hole provided in a horizontal direction, and the gaps extend linearly in the horizontal direction. The shower head further includes, below the gaps, a plurality of buffer regions extending linearly in the horizontal direction. The shower head further includes, below the buffer regions, a shower plate including a plurality of through holes disposed at a predetermined interval. The shower head can uniformly supply the process gas. |
| format | Patent |
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The cooling portion includes a cooling hole provided in a horizontal direction, and the gaps extend linearly in the horizontal direction. The shower head further includes, below the gaps, a plurality of buffer regions extending linearly in the horizontal direction. The shower head further includes, below the buffer regions, a shower plate including a plurality of through holes disposed at a predetermined interval. The shower head can uniformly supply the process gas.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210216&DB=EPODOC&CC=US&NR=10920317B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210216&DB=EPODOC&CC=US&NR=10920317B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Sato, Yuusuke</creatorcontrib><creatorcontrib>Yamada, Takumi</creatorcontrib><title>Shower head, vapor phase growth apparatus and vapor phase growth method</title><description>A shower head that supplies a process gas in a vapor phase growth apparatus includes a mixing chamber; and a plurality of cooling portions provided below the mixing chamber with gaps between cooling portions. 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The cooling portion includes a cooling hole provided in a horizontal direction, and the gaps extend linearly in the horizontal direction. The shower head further includes, below the gaps, a plurality of buffer regions extending linearly in the horizontal direction. The shower head further includes, below the buffer regions, a shower plate including a plurality of through holes disposed at a predetermined interval. The shower head can uniformly supply the process gas.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | Shower head, vapor phase growth apparatus and vapor phase growth method |
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