Method for manufacturing a semiconductor device assembly with through-mold cooling channel formed in encapsulant

Semiconductor device assemblies having stacked semiconductor dies and thermal transfer devices that include vapor chambers are disclosed herein. In one embodiment, a semiconductor device assembly includes a first semiconductor die having a base region, at least one second semiconductor die at the ba...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Bitz, Bradley R, Li, Xiao, Gandhi, Jaspreet S
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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