Electronic device having an under-fill element, a mounting method of the same, and a method of manufacturing a display apparatus having the electronic device

A mounting method of an electronic device includes providing an electronic device which includes a semiconductor chip body including an upper surface, a lower surface opposite to the upper surface, and side surfaces connecting the upper surface and the lower surface, a plurality of bumps disposed on...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Nam, Jeong-Mo, Go, Jeonghun, Yoon, Sangrock
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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